Semiconductor device package thermally coupled to passive element
US-12532737-B2 · Jan 20, 2026 · US
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Cho Eung San patents
Cho Eung San is listed as an inventor on 167 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cho Eung San |
| Total patents | 167 |
| First publication | Mar 3, 2015 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Embedded package with stacked semiconductor dies
US-2025293217-A1 · Sep 18, 2025 · US
Circuit and connector element alignment, circuit board assemblies
US-12369253-B2 · Jul 22, 2025 · US
Embedded Power Semiconductor Package with Sidewall Contacts
US-2025226293-A1 · Jul 10, 2025 · US
Antenna package with via structure and method of formation thereof
US-12300874-B2 · May 13, 2025 · US
Antenna apparatus and fabrication method
US-12272862-B2 · Apr 8, 2025 · US
Embedded package with electrically isolating dielectric liner
US-12255114-B2 · Mar 18, 2025 · US
Semiconductor package having an electrically insulating core with exposed glass fibres
US-2024332099-A1 · Oct 3, 2024 · US
Inductor connectivity and assemblies
US-2024249870-A1 · Jul 25, 2024 · US
Semiconductor package having an electrically insulating core with exposed glass fibres
US-12014964-B2 · Jun 18, 2024 · US
Recent patents
Latest publications not already listed above.
Semiconductor package with low parasitic connection to passive device
US-11973063-B2 · Apr 30, 2024 · US
Embedded Package with Electrically Isolating Dielectric Liner
US-2024120248-A1 · Apr 11, 2024 · US
Circuit and connector element alignment, circuit board assemblies
US-2024107674-A1 · Mar 28, 2024 · US
Antenna Apparatus and Fabrication Method
US-2024097313-A1 · Mar 21, 2024 · US
Semiconductor device with embedded flexible circuit
US-11916007-B2 · Feb 27, 2024 · US
Antenna Package with Via Structure and Method of Formation Thereof
US-2024047855-A1 · Feb 8, 2024 · US
Modular power device package embedded in circuit carrier
US-2024030820-A1 · Jan 25, 2024 · US
Embedded package with electrically isolating dielectric liner
US-11881437-B2 · Jan 23, 2024 · US
Antenna apparatus and fabrication method
US-11870130-B2 · Jan 9, 2024 · US
Semiconductor Device Package Thermally Coupled to Passive Element
US-2023369160-A1 · Nov 16, 2023 · US
Multi-Device Power Module Arrangement
US-2023369256-A1 · Nov 16, 2023 · US
Antenna package with via structure and method of formation thereof
US-11817617-B2 · Nov 14, 2023 · US
Method of fabricating a semiconductor package
US-11776882-B2 · Oct 3, 2023 · US
Embedded Package with Electrically Isolating Dielectric Liner
US-2023130659-A1 · Apr 27, 2023 · US
Semiconductor Package Having an Electrically Insulating Core with Exposed Glass Fibres
US-2023077139-A1 · Mar 9, 2023 · US
Semiconductor Package with Low Parasitic Connection to Passive Device
US-2023017391-A1 · Jan 19, 2023 · US
Semiconductor package having a solderable contact pad formed by a load terminal bond pad of a power semiconductor die
US-11532541-B2 · Dec 20, 2022 · US
Semiconductor packages and methods of manufacturing thereof
US-11502012-B2 · Nov 15, 2022 · US
Space efficient and low parasitic half bridge
US-11469164-B2 · Oct 11, 2022 · US
Method of fabricating a semiconductor package
US-2022230941-A1 · Jul 21, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Americas Corp | 91 |
| Infineon Technologies Ag | 39 |
| Int Rectifier Corp | 36 |
| Infineon Technologies Austria Ag | 14 |
| Infineon Techonologies Americas Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 108 |
| H10W70/481 | 96 |
| H10W90/811 | 88 |
| H01L23/49575 | 72 |
| H01L23/49562 | 69 |