Circuit and connector element alignment, circuit board assemblies

US12369253B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12369253-B2
Application numberUS-202217952895-A
CountryUS
Kind codeB2
Filing dateSep 26, 2022
Priority dateSep 26, 2022
Publication dateJul 22, 2025
Grant dateJul 22, 2025

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

This disclosure includes multiple assemblies, sub-assemblies, etc., as well as one or more methods of fabricating same. For example, a first assembly includes a first circuit board. The first circuit board further includes first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board. The first edge may be disposed substantially opposite the second edge on the first circuit board. The apparatus may further include first circuitry affixed to the first circuit board. The first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry. The first assembly is used to fabricate a second assembly.

First claim

Opening claim text (preview).

The invention claimed is: 1. A first assembly comprising: a first circuit board including first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board, the first edge disposed opposite the second edge on the first circuit board; first circuitry affixed to the first circuit board; wherein the first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry; and wherein the first circuitry affixed to the first circuit board is an inductor device, the inductor device comprising an electrically conductive path and magnetic permeable material, the electrically conductive path being electrically conductive material extending between the first axial end of the first circuitry and the second axial end of the first circuitry, the electrically conductive path of the inductor device enveloped by the magnetic permeable material. 2. The first assembly as in claim 1 , wherein the electrically conductive path is a cylindrical body fabricated from the electrically conductive material; and wherein an axis disposed along a length of the cylindrical body between the first axial end and the second axial end is substantially parallel to a plane in which the first circuit board resides. 3. The first assembly as in claim 1 , wherein cross sectional areas of the electrically conductive path are enlarged at the first axial end and the second axial end with respect to a cross sectional area of the electrically conductive path at a location between the first axial end and the second axial end. 4. The first assembly as in claim 1 further comprising: a layer of material disposed between the magnetic permeable material of the inductor device and a surface of the first circuit board, the layer of material affixing the inductor device to the first circuit board. 5. The first assembly as in claim 1 , wherein the first circuitry affixed to the first circuit board includes a series connection of the inductor device and power converter circuitry between the first axial end and the second axial end. 6. The first assembly as in claim 5 , wherein the first axial end of the first circuitry is electrically isolated from the first connector elements disposed on the first edge of the first circuit board; and wherein the second axial end of the first circuitry is electrically isolated from the second connector elements disposed on the second edge of the first circuit board. 7. The first assembly as in claim 6 , wherein the inductor device is operative to convey first current from the first axial end of the first circuitry through the first electrically conductive path of the inductor device and the second axial end of the first circuitry to a load; and wherein the first circuit board includes a second electrically conductive path connected between the second connector elements and the first connector elements, the second electrically conductive path operative to receive the first current from the load and convey the first current from the load through the second connector elements and the second electrically conductive path to the first connector elements. 8. The first assembly as in claim 1 further comprising: supplemental circuitry coupled to a second surface of the first circuit board, the second surface disposed opposite the first surface. 9. The first assembly as in claim 1 further comprising: a chip embedded in the first circuit board. 10. The first assembly as in claim 1 , wherein each of the first connector elements on the first edge of the first circuit board includes a respective cavity; and wherein each of the second connector elements on the second edge of the connector elements includes a respective cavity. 11. A second assembly comprising: the first assembly of claim 1 ; a first substrate; a second substrate; and wherein the first connector elements on the first edge are connected to the first substrate; wherein the first axial end of the first circuitry is connected to the first substrate; wherein the second connector elements on the second edge are connected to the second substrate; and wherein the second axial end of the first circuitry is connected to the second substrate. 12. The second assembly as in claim 11 , wherein the first substrate is disposed substantially parallel to the second substrate; wherein the first circuit board is disposed substantially parallel to a second circuit board; and wherein both the first circuit board and the second circuit board are disposed substantially orthogonal to the first substrate or the second substrate. 13. The first assembly as in claim 1 , wherein a combination of: i) the first edge of the first circuit board, and ii) the first axial end of the first circuitry reside in a first plane; and wherein a combination of: i) the second edge of the first circuit board, and ii) the second axial end of the first circuitry reside in a second plane. 14. The first assembly as in claim 1 , wherein the first axial end of the first circuitry is electrically isolated from the first connector elements disposed on the first edge of the first circuit board; and wherein the second axial end of the first circuitry is electrically isolated from the second connector elements disposed on the second edge of the first circuit board. 15. The first assembly as in claim 1 , wherein the first axial end of the first circuitry is physically spaced apart from the first connector elements disposed on the first edge of the first circuit board via a first portion of the magnetic permeable material; and wherein the second axial end of the first circuitry is physically spaced apart from the second connector elements disposed on the second edge of the first circuit board via a second portion of the magnetic permeable material. 16. The first assembly as in claim 1 , wherein the magnetic permeable material includes a planar surface; and wherein the planar surface of the magnetic permeable material is affixed to the first circuit board. 17. The first assembly as in claim 1 , wherein the first connector elements and the first axial end of the first circuitry are directly connected to a second circuit board; and wherein the second connector elements and the second axial end of the first circuitry are directly connected to nodes of a third circuit board. 18. The first assembly as in claim 17 , wherein the first circuitry is operative to convey first current received from the second circuit board through the first circuitry to a load coupled to the third circuit board; and wherein the first circuit board includes a second electrically conductive path connected between the second connector elements and the first connector elements, the second electrically conductive path operative to: i) receive the first current from the load through the second connector elements, and ii) convey the first current through the second electrically conductive path to the first connector elements. 19. A first assembly comprising: a first circuit board including first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board, the first edge disposed opposite the second edge on the first circuit board; first circuitry affixed to the first circuit board; second circuitry affixed to the first circuit board; wherein the first

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12369253B2 cover?
This disclosure includes multiple assemblies, sub-assemblies, etc., as well as one or more methods of fabricating same. For example, a first assembly includes a first circuit board. The first circuit board further includes first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board. The first edg…
Who is the assignee on this patent?
Infineon Technologies Austria Ag
What technology area does this patent fall under?
Primary CPC classification H05K1/18. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 22 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).