QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same
US-12087673-B2 · Sep 10, 2024 · US
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Castro Abram patents
Castro Abram is listed as an inventor on 34 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Castro Abram |
| Total patents | 34 |
| First publication | Feb 5, 2015 |
| Latest publication | Sep 10, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Acoustic device package and method of making
US-11838004-B2 · Dec 5, 2023 · US
QFN Device Having A Mechanism That Enables An Inspectable Solder Joint When Attached To A PWB And Method Of Making Same
US-2023057405-A1 · Feb 23, 2023 · US
QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same
US-11495524-B2 · Nov 8, 2022 · US
Packaged semiconductor system having unidirectional connections to discrete components
US-10756013-B2 · Aug 25, 2020 · US
Printed adhesion deposition to mitigate integrated circuit package delamination
US-10727085-B2 · Jul 28, 2020 · US
Packaged semiconductor system having unidirectional connections to discrete components
US-2020185323-A1 · Jun 11, 2020 · US
Packaged semiconductor system having unidirectional connections to discrete components
US-10566276-B2 · Feb 18, 2020 · US
QFN Device Having A Mechanism That Enables An Inspectable Solder Joint When Attached To A PWB And Method Of Making Same
US-2019378783-A1 · Dec 12, 2019 · US
Acoustic Device Package And Method Of Making
US-2019214964-A1 · Jul 11, 2019 · US
Recent patents
Latest publications not already listed above.
Printed adhesion deposition to mitigate integrated circuit delamination
US-10347508-B2 · Jul 9, 2019 · US
Packaged semiconductor system having unidirectional connections to discrete components
US-2019139883-A1 · May 9, 2019 · US
Acoustic device package and method of making
US-10284172-B2 · May 7, 2019 · US
Plastic-packaged semiconductor device having wires with polymerized insulating layer
US-10199348-B2 · Feb 5, 2019 · US
Method of packaging a circuit
US-9875930-B2 · Jan 23, 2018 · US
Packaged device with additive substrate surface modification
US-9780017-B2 · Oct 3, 2017 · US
Printed adhesion deposition to mitigate integrated circuit delamination
US-2017271174-A1 · Sep 21, 2017 · US
Printed adhesion deposition to mitigate integrated circuit delamination
US-2017194170-A1 · Jul 6, 2017 · US
Method for preventing die pad delamination
US-9601414-B2 · Mar 21, 2017 · US
Packaged Device with Additive Substrate Surface Modification
US-2017053854-A1 · Feb 23, 2017 · US
Method of making integrated circuit
US-9536781-B2 · Jan 3, 2017 · US
Packaged device with additive substrate surface modification
US-9524926-B2 · Dec 20, 2016 · US
Acoustic device package and method of making
US-2016322557-A1 · Nov 3, 2016 · US
Packaging a semiconductor device having wires with polymerized insulator skin
US-2016307866-A1 · Oct 20, 2016 · US
Packaging a semiconductor device having wires with polymerized insulator skin
US-9378984-B2 · Jun 28, 2016 · US
Method for preventing die pad delamination
US-2016181183-A1 · Jun 23, 2016 · US
Packaged semiconductor device having leadframe features as pressure valves against delamination
US-9305869-B1 · Apr 5, 2016 · US
Packaged device with additive substrate surface modification
US-2016093558-A1 · Mar 31, 2016 · US
Flip chip led package
US-2016064630-A1 · Mar 3, 2016 · US
Method for preventing die pad delamination
US-9214440-B1 · Dec 15, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Texas Instruments Inc | 34 |
| Gallegos Bernardo | 1 |
| Castro Abram | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/756 | 24 |
| H10W90/736 | 24 |
| H10W74/00 | 24 |
| H10W72/884 | 24 |
| H10W72/073 | 22 |