3D-printed protective shell structures for stress sensitive circuits
US-10516381-B2 · Dec 24, 2019 · US
Acoustic device package and method of making
US10284172B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10284172-B2 |
| Application number | US-201514698616-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 28, 2015 |
| Priority date | Apr 28, 2015 |
| Publication date | May 7, 2019 |
| Grant date | May 7, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An assembly including an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa, an acoustic device die having opposite end portions mounted on and electrically connected to the electrical connection substrate and a mold compound layer encapsulating the acoustic device die and interfacing with the substrate.
First claim
Opening claim text (preview).
What is claim is: 1. An assembly comprising: an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa; an acoustic device die having a mid portion and opposite end portions mounted on and electrically coupled to said electrical connection substrate; and a mold compound layer encapsulating said acoustic device die and interfacing with said substrate. 2. The assembly of claim 1 , said mold compound layer having a Young's modulus of less than about 100 MPa. 3. The assembly of claim 1 , said electrical connection substrate being formed of a foam material. 4. The assembly of claim 1 , said electrical connection substrate being formed of at least one of silicone, polyisobutylene, polyurethane, and acrylic resin. 5. The assembly of claim 1 , said acoustic device die being mounted on and electrically coupled to said electrical connection substrate by solder balls. 6. The assembly of claim 5 , said solder balls being located at said opposite end portions of said device die. 7. The assembly of claim 6 , said mid portion of said acoustic device die being physically spaced apart from said substrate. 8. The assembly of claim 1 further comprising a system board module wherein said electrical connection substrate is physically and electrically connected to said system board module. 9. The assembly of claim 1 wherein said acoustic device die comprises a bulk acoustic wave (BAW) device die. 10. An assembly comprising: an electrical connection substrate; a acoustic device die having a mid portion and having opposite end portions mounted on and electrically connected to said electrical connection substrate; and a mold compound layer encapsulating said acoustic device die and interfacing with said substrate and having a Young's modulus of less than about 100 MPa. 11. The assembly of claim 10 , said mold compound layer being formed of a foam material. 12. The assembly of claim 10 , said mold compound layer being formed of at least one of silicone, polyisobutylene, polyurethane, and acrylic resin. 13. The assembly of claim 10 , said acoustic device die being mounted on and electrically connected to said electrical connection substrate by solder balls. 14. The assembly of claim 13 , said solder balls being located at said opposite end portions of said acoustic device die. 15. The assembly of claim 14 , said mid portion of said acoustic device die being physically spaced apart from said substrate. 16. The assembly of claim 10 further comprising a system board module wherein said electrical connection substrate is physically and electrically connected to said system board module.
Assignees
Inventors
Classifications
for bulk acoustic wave [BAW] devices · CPC title
- H03H9/1042Primary
the enclosure being defined by a housing formed by a cavity in a resin · CPC title
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Frequently asked questions
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- What does patent US10284172B2 cover?
- An assembly including an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa, an acoustic device die having opposite end portions mounted on and electrically connected to the electrical connection substrate and a mold compound layer encapsulating the acoustic device die and interfacing with the substrate.
- Who is the assignee on this patent?
- Texas Instruments Inc
- What technology area does this patent fall under?
- Primary CPC classification H03H9/1042. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 07 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).