Acoustic device package and method of making

Patent metadata

Field	Value
Publication number	US-11838004-B2
Application number	US-201916356890-A
Country	US
Kind code	B2
Filing date	Mar 18, 2019
Priority date	Apr 28, 2015
Publication date	Dec 5, 2023
Grant date	Dec 5, 2023

Abstract

An assembly including an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa, an acoustic device die having opposite end portions mounted on and electrically connected to the electrical connection substrate and a mold compound layer encapsulating the acoustic device die and interfacing with the substrate.

First claim

What is claimed is:

1. A bulk acoustic wave (BAW) package comprising:
a substrate formed of material having a Young's modulus of less than about 10 MPa with a first surface and an opposite second surface having first and second spaced apart contact pads on the first surface and first and second spaced apart contact pads on the second surface; and
a BAW device electrically coupled to said substrate, said BAW device comprising:
a laterally extending body having a BAW electrical circuit formed therein;
a first solder ball attached to said laterally extending body and electrically connected to said BAW electrical circuit and electrically connected to said first contact pad on said first surface of said substrate; and
a second solder ball physically attached to said laterally extending body and electrically connected to said BAW electrical circuit and electrically connected to said second contact pad on said first surface of said substrate; and
first and second solder balls attached to said first and second spaced apart contact pads on said second surface of said substrate; and

a mold compound layer covering said BAW device, interfacing with said first surface of said substrate and having a Young's modulus of less than about 100 MPa.

2. The bulk acoustic wave (BAW) package of claim 1 , said mold compound layer being formed of a foam material.

3. The bulk acoustic wave (BAW) package of claim 1 , said mold compound layer being formed of at least one of silicone, polyisobutylene, polyurethane, and acrylic resin.

4. A method of making a bulk acoustic wave (BAW) package comprising at least one of:
physically and electrically mounting a BAW device on an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa; and
encapsulating said BAW device in a mold compound layer having a Young's modulus of less than about 100 MPa.

5. The bulk acoustic wave (BAW) package of claim 1 , a mid portion of said laterally extending body physically spaced apart from said substrate.

6. The bulk acoustic wave (BAW) package of claim 1 , said substrate being formed of a foam material.

7. The bulk acoustic wave (BAW) package of claim 1 , said substrate being formed of at least one of silicone, polyisobutylene, polyurethane, and acrylic resin.

8. The method of making a bulk acoustic wave (BAW) package of claim 4 , said electrical connection substrate being formed of a foam material.

9. The method of making a bulk acoustic wave (BAW) package of claim 4 , said electrical connection substrate being formed of at least one of silicone, polyisobutylene, polyurethane, and acrylic resin.

10. The method of making a bulk acoustic wave (BAW) package of claim 4 , said mold compound layer being formed of a foam material.

11. The bulk acoustic wave (BAW) package of claim 1 , said mold compound layer being formed of at least one of silicone, polyisobutylene, polyurethane, and acrylic resin.

12. A bulk acoustic wave (BAW) package comprising:
a substrate formed of material having a first Young's modulus; and
a BAW device electrically coupled to said substrate, said BAW device comprising:
a laterally extending body having a BAW electrical circuit formed therein;
a first solder ball electrically connected to said BAW electrical circuit and electrically connected to said substrate;
a second solder ball electrically connected to said BAW electrical circuit and electrically connected to said substrate; and
; and

a mold compound layer covering said BAW device, and a portion of said substrate, the mold compound layer having a second Young's modulus.

13. The bulk acoustic wave (BAW) package of claim 12 , said mold compound layer being formed of a foam material.

14. The bulk acoustic wave (BAW) package of claim 12 , said mold compound layer being formed of at least one of silicone, polyisobutylene, polyurethane, and acrylic resin.

15. The bulk acoustic wave (BAW) package of claim 12 , said substrate being formed of a foam material.

16. The bulk acoustic wave (BAW) package of claim 12 , said substrate being formed of at least one of silicone, polyisobutylene, polyurethane, and acrylic resin.

17. The bulk acoustic wave (BAW) package of claim 12 , wherein the first Young's modulus is less than the second Young's modulus.

Assignees

• Texas Instruments Inc

Inventors

• Tuncer Enis
• Castro Abram

Classifications

• H03H9/1042 Primary

  the enclosure being defined by a housing formed by a cavity in a resin · CPC title

• H03H9/1007

  for bulk acoustic wave [BAW] devices · CPC title