Mems sensor arrangement and method for manufacturing a mems sensor arrangement
US-2026035236-A1 · Feb 5, 2026 · US
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Bieselt Steffen patents
Bieselt Steffen is listed as an inventor on 76 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bieselt Steffen |
| Total patents | 76 |
| First publication | Jun 11, 2015 |
| Latest publication | Feb 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing a vertical rf bipolar transistor, vertical rf bipolar transistor, and semiconductor device
US-2025380437-A1 · Dec 11, 2025 · US
Semiconductor component including an electronic component based on polycrystalline silicon
US-12477823-B2 · Nov 18, 2025 · US
Semiconductor die with pressure and acceleration sensor elements
US-2025305900-A1 · Oct 2, 2025 · US
Semiconductor die with pressure and acceleration sensor elements
US-12359994-B2 · Jul 15, 2025 · US
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
US-12332271-B2 · Jun 17, 2025 · US
Sensor system with a microelectromechanical sensor element and method for producing a sensor system
US-2024343555-A1 · Oct 17, 2024 · US
Semiconductor Component Including an Electronic Component Based on Polycrystalline Silicon
US-2024282774-A1 · Aug 22, 2024 · US
Sensor system with a microelectromechanical sensor element and method for producing a sensor system
US-12043539-B2 · Jul 23, 2024 · US
Method of producing a semiconductor component and semiconductor component
US-12002812-B2 · Jun 4, 2024 · US
Recent patents
Latest publications not already listed above.
Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor element
US-11493532-B2 · Nov 8, 2022 · US
Sensor system with a microelectromechanical sensor element and method for producing a sensor system
US-2022348453-A1 · Nov 3, 2022 · US
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
US-2022326275-A1 · Oct 13, 2022 · US
Method of producing a semiconductor component and semiconductor component
US-2022285402-A1 · Sep 8, 2022 · US
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
US-11422151-B2 · Aug 23, 2022 · US
Semiconductor die with pressure and acceleration sensor elements
US-2022074803-A1 · Mar 10, 2022 · US
Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process
US-11078072-B2 · Aug 3, 2021 · US
Micro-mechanical sensor and method for manufacturing a micro-electro-mechanical sensor
US-10961116-B2 · Mar 30, 2021 · US
Stressed decoupled micro-electro-mechanical system sensor
US-10870575-B2 · Dec 22, 2020 · US
Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor element
US-2020379004-A1 · Dec 3, 2020 · US
Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor element
US-10852319-B2 · Dec 1, 2020 · US
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
US-2020300886-A1 · Sep 24, 2020 · US
Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a cmos process
US-2020290867-A1 · Sep 17, 2020 · US
Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process
US-10683203-B2 · Jun 16, 2020 · US
Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device
US-10684306-B2 · Jun 16, 2020 · US
Microelectromechanical device and method for forming a microelectromechanical device having a support structure holding a lamella structure
US-10580663-B2 · Mar 3, 2020 · US
Integrated semiconductor device and manufacturing method
US-10544037-B2 · Jan 28, 2020 · US
Accelerometer with compatibility to complementary metal-oxide-semiconductor technologies
US-10539587-B2 · Jan 21, 2020 · US
Stressed decoupled micro-electro-mechanical system sensor
US-2020002159-A1 · Jan 2, 2020 · US
Micro-mechanical sensor and method for manufacturing a micro-electro-mechanical sensor
US-2019345027-A1 · Nov 14, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Dresden Gmbh | 46 |
| Infineon Tech Dresden Gmbh & Co Kg | 19 |
| Infineon Technologies Ag | 12 |
| Infineon Tech Desden Gmbh | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B81B2201/0235 | 29 |
| H10W10/021 | 25 |
| H10W10/20 | 25 |
| B81B2201/0264 | 23 |
| B81B7/02 | 23 |