Method for making a cover for an electronic package and electronic package comprising a cover

Patent metadata

Field	Value
Publication number	US-10483408-B2
Application number	US-201715689976-A
Country	US
Kind code	B2
Filing date	Aug 29, 2017
Priority date	Jan 3, 2017
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

First claim

The invention claimed is:

1. A method for manufacturing at least one cover for an electronic package, comprising:
placing at least one optical insert, having opposite faces and configured to allow light radiation to pass therethrough, within a cavity of a closed two-part injection mold in a position such that said opposite faces of said at least one optical insert make contact, respectively, with a surface of an upper part and a surface of a lower part of the closed two-part injection mold;
injecting a coating material into said cavity of the closed two-part injection mold to surround said at least one optical insert;
setting the coating material in order to obtain a substrate that is overmolded around said at least one optical insert; and
cutting through the overmolded substrate to produce at least one cover comprising the at least one optical insert and at least a portion of said overmolded substrate.

2. The method according to claim 1 , wherein cutting through said overmolded substrate comprises cutting peripherally around and at a distance from said at least one optical insert.

3. The method according to claim 1 , forming each of the surfaces of the upper part and lower part of said two-part injection mold with a layer made of a compressible material such that said opposite faces of said at least one optical insert in the closed two-part injection mold are in contact with the layers of compressible material.

4. The method according to claim 1 , wherein said surfaces of the upper part and lower part of the two-part injection mold are parallel.

5. The method according to claim 1 , wherein one surface of the upper part or lower part of the two-part injection mold comprises at least one zone surrounded by at least one groove, said zone making contact with one of the faces of the at least one optical insert, such that the coating material injected into said cavity of the closed two-part injection mold also fills said groove to produce at least one protruding rib extending from said overmolded substrate at a location corresponding to said groove.

6. The method according to claim 5 , wherein cutting through said overmolded substrate further comprises cutting through said protruding rib.

7. The method according to claim 5 , further comprising mounting the cover over an integrated circuit chip having an optical sensor, wherein said at least one optical insert is in alignment with the optical sensor, and wherein mounting comprises attaching a bottom edge of the protruding rib to a support substrate to which the integrated circuit chip is mounted.

8. The method according claim 1 , wherein said at least one optical insert comprises first and second optical inserts, wherein one surface of the upper part or lower part of the two-part injection mold comprises at least two zones surrounded by at least one main protruding groove, said two zones separated by at least one intermediate groove, each zone for making contact with one of the faces of each of said first and second optical inserts, respectively, such that the coating material injected into said cavity of the closed two-part injection mold also fills both the main protruding groove and the intermediate groove to produce at least one peripheral protruding rib extending from said overmolded substrate at a location corresponding to said main protruding groove and at least one intermediate rib extending from said overmolded substrate at a location corresponding to said intermediate groove.

9. The method according to claim 8 , wherein cutting through said overmolded substrate further comprises cutting through said peripheral protruding rib.

10. The method according to claim 8 , wherein said intermediate groove further includes a shallower part, such that the intermediate rib of said overmolded substrate includes a notch.

11. The method according to claim 8 , further comprising mounting the cover over an integrated circuit chip having an optical sensor, wherein said first optical insert is in alignment with the optical sensor, and wherein mounting comprises attaching a bottom edge of the peripheral protruding rib to a support substrate to which the integrated circuit chip is mounted.

12. The method according to claim 1 , further comprising mounting the cover over an integrated circuit chip having an optical sensor, wherein said at least one optical insert is in alignment with the optical sensor.

13. A method for manufacturing, comprising:
placing a first optical insert and a second optical insert, wherein each of the first and second optical inserts has opposite faces and is configured to allow light radiation to pass therethrough, within opposite faces of a cavity of a closed two-part injection mold in a position such that said opposite faces of said first and second optical inserts make contact, respectively, with a surface of an upper part and a surface of a lower part of the closed two-part injection mold;
injecting a coating material into said cavity of the closed two-part injection mold to surround said first and second optical inserts;
setting the coating material in order to obtain a substrate that is overmolded around said first and second optical inserts.

14. The method according to claim 13 , further comprising cutting through said overmolded substrate to define a peripheral edge of a cover for an electronic package.

15. The method according to claim 13 , wherein the surfaces of the upper part and lower part of the two-part injection mold are made of a compressible material which bears on the opposite faces of the first and second optical inserts.

16. The method according to claim 13 , wherein said surfaces of the upper part and lower part of the two-part injection mold are parallel.

17. The method according to claim 13 , wherein one surface of the upper part or lower part of the two-part injection mold comprises a groove positioned between the first and second optical inserts, and wherein the coating material injected into said cavity fills said groove to produce a rib extending from the substrate and positioned between the first and second optical inserts.

18. The method according to claim 13 , wherein one surface of the upper part or lower part of the two-part injection mold comprises a groove which extends to surround the first and second optical inserts, and wherein the coating material injected into said cavity fills said groove to produce a rib extending from the substrate and which surrounds the first and second optical inserts.

19. The method according to claim 18 , further comprising cutting through said overmolded substrate to define a peripheral edge of a cover for an electronic package, and wherein said cutting divides the rib which surrounds the first and second optical inserts.

20. The method according to claim 19 , further comprising mounting the cover over an integrated circuit chip having an optical sensor, wherein one of said first and second optical inserts is in alignment with the optical sensor, and wherein mounting comprises attaching a bottom edge of the rib to a support substrate to which the integrated circuit chip is mounted.

21. The method according to claim 13 , wherein one surface of the upper part or lower part of the two-part injection mold comprises a first groove which extends to surround the first and second optical inserts and a second groove positioned between the first and second optical inserts, wherein the coating material injected into said cavity fills said first and second grooves to produce a peripheral rib extendin

Assignees

• St Microelectronics Grenoble 2

Inventors

• Saxod Karine
• Mas Alexandre
• Saugier Eric
• Lobascio Gaetan
• Besancon Benoit

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• B29L2031/3481

  Housings or casings incorporating or embedding electric or electronic elements · CPC title

• B29C45/14778

  the article consisting of a material with particular properties, e.g. porous, brittle · CPC title

• B29K2995/0026

  Transparent · CPC title

• B29C45/14065

  Positioning or centering articles in the mould · CPC title