Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover

Patent metadata

Field	Value
Publication number	US-11114312-B2
Application number	US-201916394925-A
Country	US
Kind code	B2
Filing date	Apr 25, 2019
Priority date	Jan 3, 2017
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.

First claim

The invention claimed is:

1. A method for manufacturing, comprising the following steps:
placing at least one insert having opposite faces in a cavity of a mold having opposite surfaces, said insert positioned such that at least part of one of the opposite faces of the insert makes contact with at least part of one of the opposite surfaces of the mold;
injecting a coating material into said cavity; and
setting the coating material in order to obtain an overmolded substrate within which said insert is at least partly included to form an encapsulation cover comprising the at least one insert and at least a portion of said overmolded substrate.

2. The method according to claim 1 , further comprising cutting through said overmolded substrate at a distance from said insert.

3. The method according to claim 1 , further comprising placing at least part of another one of the opposite faces of said insert in contact with at least part of another one of the opposite surfaces of said mold.

4. The method according to claim 1 , further comprising positioning at least one layer made of a compressible material along at least one of said opposite surfaces of said mold with the face of the insert in contact with the layer of compressible material.

5. The method according to claim 1 , where one of said opposite surfaces of the mold comprises at least one zone surrounded by at least one groove, the injected coating material filling said groove so that said overmolded substrate includes at least one protruding ring-shaped rib corresponding to said groove of the mold.

6. The method according to claim 5 , further comprising cutting through said overmolded substrate and said protruding ring-shaped rib.

7. A method for manufacturing, comprising the following steps:
placing at least one insert having opposite faces in a two-part mold having a first part and a second part defining a cavity, the first and second parts having opposite surfaces, said insert positioned such that at least part of one of the opposite faces of the insert makes contact with at least part of one of the opposite surfaces of the two-part mold;
injecting a coating material into said cavity; and
setting the coating material in order to obtain an overmolded substrate that at least partly overmolds said insert to form an encapsulation cover comprising the at least one insert and at least a portion of said overmolded substrate.

8. The method according to claim 7 , further comprising cutting through said overmolded substrate at a distance from said insert.

9. The method according to claim 7 , further comprising placing at least part of another one of the opposite faces of said insert in contact with at least part of another one of the opposite surfaces of said mold.

10. The method according to claim 7 , further comprising positioning at least one layer made of a compressible material along at least one of said opposite surfaces of said mold with the insert in contact with the layer of compressible material.

11. The method according to claim 7 , where one of said opposite surfaces of the mold comprises at least one zone surrounded by at least one groove, the injected coating material filling said groove so that said overmolded substrate includes at least one protruding ring-shaped rib corresponding to said groove of the mold.

12. The method according to claim 11 , further comprising cutting through said overmolded substrate and said protruding ring-shaped rib.

13. A method for manufacturing, comprising the following steps:
placing a plurality of inserts, each insert having opposite faces, in spaced apart positions within a two-part mold having a first part and a second part defining a cavity, the first and second parts have opposite surfaces, said insert positioned such that at least part of one of the opposite faces of the insert makes contact with at least part of one of the opposite surfaces of the two-part mold;
injecting a coating material into said cavity;
setting the coating material in order to obtain a set coating material providing a substrate that at least partly overmolds said plurality of inserts to form an overmolded structure; and
dicing the overmolded structure at locations between inserts to form a plurality of encapsulation covers, wherein each encapsulation cover comprises at least one insert and at least a portion of the set coating material.

14. The method according to claim 13 , further comprising placing at least part of another one of the opposite faces of each insert in contact with at least part of another one of the opposite surfaces of said mold.

15. The method according to claim 13 , further comprising positioning at least one layer made of a compressible material along at least one of said opposite surfaces of said mold with the inserts in contact with the layer of compressible material.

16. The method according to claim 13 , where one of said opposite surfaces of the mold comprises a plurality of zones with each zone surrounded by a groove, the injected coating material filling said groove so that said overmolded structure includes a protruding ring-shaped rib corresponding to said groove of the mold.

17. The method according to claim 13 , wherein dicing further comprises cutting through said protruding ring-shaped rib.

Assignees

• St Microelectronics Grenoble 2

Inventors

• Besancon Benoit
• Mas Alexandre
• Saxod Karine

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W76/60

  Seals · CPC title

• H10W76/47

  Solid or gel fillings · CPC title