Method for making a cover for an electronic package and electronic package comprising a cover

Patent metadata

Field	Value
Publication number	US-2018190838-A1
Application number	US-201715689976-A
Country	US
Kind code	A1
Filing date	Aug 29, 2017
Priority date	Jan 3, 2017
Publication date	Jul 5, 2018
Grant date	—

Abstract

A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

First claim

1 . A method for manufacturing at least one cover for an electronic package, comprising the following steps:
placing at least one optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between opposite faces of a cavity of a mold in a position such that said opposite faces of each optical insert make contact with said opposite faces of said cavity of the mold; injecting a coating material into said cavity and around each optical insert; and setting the coating material in order to obtain a substrate that is overmolded around each optical insert and produce at least one cover comprising the at least one optical insert and at least a portion of said overmolded substrate.

2 . The method according to claim 1 , further comprising cutting through said overmolded substrate and at a distance from said optical insert.

3 . The method according to claim 1 , forming the opposite faces of said cavity with opposite layers made of a compressible material such that said opposite faces of each optical insert bear on the opposite layers.

4 . The method according to claim 1 , wherein said opposite faces of the cavity of the mold are parallel.

5 . The method according to claim 1 , wherein one face of the cavity of the mold comprises at least one zone surrounded by at least one groove, said zone providing a surface for making contact with one of the faces of the optical insert, such that the coating material injected into said cavity fills said groove to produce said overmolded substrate provided with at least one protruding rib corresponding to said groove.

6 . The method according to claim 5 , further comprising cutting through said overmolded substrate and through said protruding rib.

7 . The method according claim 1 , wherein one face of the cavity of the mold comprises at least two zones surrounded by at least one main protruding groove, said two zones separated by at least one intermediate groove, each zone proving a surface for making contact with one of the faces of a corresponding optical insert, such that the coating material injected into said cavity fills both the main protruding groove and the intermediate groove to produce said overmolded substrate provided with at least one peripheral protruding rib corresponding to said main protruding groove of the mold and at least one intermediate rib corresponding to said intermediate groove of the mold.

8 . The method according to claim 7 , further comprising cutting through said overmolded substrate and through said peripheral protruding rib.

9 . The method according to claim 7 , wherein said intermediate groove further includes a shallower part, such that the intermediate rib of said overmolded substrate includes a notch.

10 . An electronic package, comprising:
a carrier substrate; at least one electronic chip having a back face fixed to a front mounting face of the carrier substrate and having a front face including at least one integrated optical element; and an encapsulation cover of said chip, comprising a substrate that is overmolded around an optical insert configured to allow light radiation to pass from one side of the overmolded substrate to another side of the overmolded substrate, said encapsulation cover being fixed at least above said mounting face of said carrier substrate in a position such that the encapsulation cover extends above the electronic chip.

11 . The package according to claim 10 , wherein said encapsulation cover is fixed above said carrier substrate by way of an annular bead of adhesive interposed between a peripheral zone of the carrier substrate and a peripheral zone of said overmolded substrate.

12 . The package according to claim 10 , wherein said encapsulation cover is fixed above said carrier substrate by way of an annular strip of adhesive interposed between a peripheral zone of the carrier substrate and a peripheral zone of said overmolded substrate.

13 . The package according to claim 12 , wherein said overmolded substrate is provided with a ring-shaped rib surrounding said chip at a distance, the encapsulation cover being fixed above said carrier substrate by way of said annular strip of adhesive mounting said ring-shaped rib.

14 . The package according to claim 13 , wherein said overmolded substrate is further provided with an intermediate rib delimiting two chambers, the encapsulation cover being fixed above said carrier substrate by way of a strip of adhesive mounting said intermediate rib.

15 . The package according to claim 14 , wherein said at least one electronic chip comprises a first electronic chip within one of said two chambers and a second electronic chip within another of said two chambers.

16 . The package according to claim 14 , wherein said electronic chip extends through a notch of said intermediate rib, and wherein this intermediate rib is fixed on said chip by way of a strip of adhesive.

17 . The package according to claim 16 , wherein said electronic chip includes a first optical sensor within one of said two chambers and a second optical sensor within another of said two chambers.

18 . The package according to claim 17 , further including another electronic chip provided with an optical transmitter within said another of said two chambers.

19 . The package according to claim 14 , wherein said optical insert is located on one side of said intermediate rib and further including another optical insert located on another side of said intermediate rib.

20 . A cover for an electronic package, comprising:
an optical insert having opposite faces made of a material configured to allow light radiation to pass through from one face to another face; and a substrate, made of an opaque coating material, overmolded around the optical insert such that said opposite faces of the optical insert are at least partly uncovered.

21 . The cover according to claim 20 , in which said overmolded substrate is provided, as a single part, with a ring-shaped rib surrounding at a distance from and protruding with respect to one of said opposite faces of said optical insert.

Assignees

• St Microelectronics Grenoble 2

Inventors

• Saxod Karine
• Mas Alexandre
• Saugier Eric
• Lobascio Gaetan
• Besancon Benoit

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• B29L2031/3481

  Housings or casings incorporating or embedding electric or electronic elements · CPC title

• B29K2995/0026

  Transparent · CPC title

• B29C45/14065

  Positioning or centering articles in the mould · CPC title

• B29C45/14778

  the article consisting of a material with particular properties, e.g. porous, brittle · CPC title