Phase change material (PCM)-based conductive thermal actuator switch
US-12586845-B2 · Mar 24, 2026 · US
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Benedict James E patents
Benedict James E is listed as an inventor on 61 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Benedict James E |
| Total patents | 61 |
| First publication | May 16, 2019 |
| Latest publication | Mar 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Thermally-Enhanced and Deployable Structures
US-2026015995-A1 · Jan 15, 2026 · US
Thermally-enhanced and deployable structures
US-12398704-B2 · Aug 26, 2025 · US
Ball bond impedance matching
US-12266629-B2 · Apr 1, 2025 · US
Low profile phased array
US-12021306-B2 · Jun 25, 2024 · US
Method for forming channels in printed circuit boards by stacking slotted layers
US-2023209728-A1 · Jun 29, 2023 · US
Printed circuit board automated layup system
US-11653484-B2 · May 16, 2023 · US
Additive manufacturing technology microwave vertical launch
US-2023121347-A1 · Apr 20, 2023 · US
Phase change material (pcm)-based conductive thermal actuator switch
US-2023081977-A1 · Mar 16, 2023 · US
Method for forming channels in printed circuit boards by stacking slotted layers
US-11606865-B2 · Mar 14, 2023 · US
Recent patents
Latest publications not already listed above.
Spiral antenna and related fabrication techniques
US-11581652-B2 · Feb 14, 2023 · US
Millimeter wave phased array
US-11569574-B2 · Jan 31, 2023 · US
Method for manufacturing non-planar arrays with a single flex-hybrid circuit card
US-11497118-B2 · Nov 8, 2022 · US
Method for fabricating Z-axis vertical launch
US-11470725-B2 · Oct 11, 2022 · US
Additive manufactured reactive beamformer
US-11432408-B2 · Aug 30, 2022 · US
Method for manufacturing non-planar arrays with a single flex-hybrid circuit card
US-2022264745-A1 · Aug 18, 2022 · US
Ball bond impedance matching
US-2022254750-A1 · Aug 11, 2022 · US
Method of manufacturing radio frequency interconnections
US-11375609-B2 · Jun 28, 2022 · US
Spiral antenna and related fabrication techniques
US-2022140485-A1 · May 5, 2022 · US
PCB cavity mode suppression
US-11317502-B2 · Apr 26, 2022 · US
Spiral antenna and related fabrication techniques
US-11289814-B2 · Mar 29, 2022 · US
Low profile phased array
US-2022052460-A1 · Feb 17, 2022 · US
Preparation of solder bump for compatibility with printed electronics and enhanced via reliability
US-2021400820-A1 · Dec 23, 2021 · US
System and method for fabricating z-axis vertical launch
US-2021368629-A1 · Nov 25, 2021 · US
Pcb cavity mode suppression
US-2021360772-A1 · Nov 18, 2021 · US
Process for removing bond film from cavities in printed circuit boards
US-11171101-B2 · Nov 9, 2021 · US
Low profile phased array
US-11158955-B2 · Oct 26, 2021 · US
Advanced communications array
US-11145952-B2 · Oct 12, 2021 · US
Interlocking modular beamformer
US-11145977-B2 · Oct 12, 2021 · US
Process for removing bond film from cavities in printed circuit boards
US-2021305187-A1 · Sep 30, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Raytheon Co | 61 |
| Thermavant Tech Llc | 3 |
| Univ Massachusetts | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/0219 | 24 |
| H05K3/4038 | 23 |
| B33Y80/00 | 14 |
| B33Y10/00 | 14 |
| H05K2201/10287 | 11 |