Advanced communications array

Patent metadata

Field	Value
Publication number	US-11145952-B2
Application number	US-201916683593-A
Country	US
Kind code	B2
Filing date	Nov 14, 2019
Priority date	Nov 14, 2019
Publication date	Oct 12, 2021
Grant date	Oct 12, 2021

Abstract

A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.

First claim

What is claimed is:

1. A communications array comprising:
a support structure configured to support array elements, the support structure having a top planar surface; and
a plurality of array elements supported by the support structure, each array element being fabricated from an advanced manufacturing techniques (AMT) process, each array element being spaced from one another a predefined distance to create an air gap between adjacent array elements, each array element having a top surface that is parallel to and spaced from the top planar surface of the support structure.

2. The communications array of claim 1 , wherein the support structure is fabricated from a printed circuit board (PCB) or similar dielectric material.

3. The communications array of claim 1 , wherein each array element of the plurality of array elements includes a radiator.

4. The communications array of claim 1 , wherein the plurality of array elements includes an 8×8 array having 64 array elements.

5. The communications array of claim 1 , wherein each array element is square-shaped.

6. The communications array of claim 5 , wherein each array element includes an overall length and width of 0.210 inches, with the array element having a length and width of 0.90 inches.

7. The communications array of claim 1 , wherein a process panel is used to manufacture the communications array.

8. The communications array of claim 1 , further comprising a copper vertical launch (CVL).

9. The communications array of claim 8 , wherein the CVL includes staking a copper wire into a hole formed in the support structure.

10. The communications array of claim 1 , further comprising an electromagnetic boundary.

11. The communications array of claim 10 , wherein the electromagnetic boundary includes machining a trench through the support structure and filling the trench with a conductive material.

12. The communications array of claim 11 , wherein the conductive material includes a conductive ink applied by the AMT process.

13. The communications array of claim 1 , wherein a weight of the communications array does not exceed 0.7 oz. (20 g).

Assignees

• Raytheon Co

Inventors

• Sikina Thomas V
• Haven John P
• Wilder Kevin
• Benedict James E
• Southworth Andrew R
• Herndon Mary K

Classifications

• H05K2201/10287

  Metal wires as connectors or conductors · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title

• H05K3/12

  using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title

• H05K3/043

  by using a moving tool for milling or cutting the conductive material · CPC title