Method for fabricating Z-axis vertical launch

Patent metadata

Field	Value
Publication number	US-11470725-B2
Application number	US-202117395977-A
Country	US
Kind code	B2
Filing date	Aug 6, 2021
Priority date	Aug 15, 2019
Publication date	Oct 11, 2022
Grant date	Oct 11, 2022

Abstract

An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

First claim

What is claimed is:

1. A method of automating a fabrication of a copper vertical launch within a printed circuit board (PCB), the method comprising:
feeding copper wire to a wire cutting and gripping mechanism;
cutting and securing a segment of copper wire;
inserting the segment of copper wire into a hole formed within the PCB;
soldering an end of the segment of copper wire to a signal trace of the PCB; and
flush cutting an opposite end of the segment of the copper wire to a surface of the PCB.

2. The method of claim 1 , wherein feeding copper wire includes receiving copper wire from a spool of copper wire.

3. The method of claim 1 , further comprising removing waste generated from cutting the copper wire during a trimming operation.

4. The method of claim 3 , wherein removing waste includes a vacuum device or plenum that has a channel formed therein to channel waste and a vacuum source to provide a suction required to move the waste.

5. The method of claim 1 , wherein feeding copper wire includes guiding the copper wire with a set of pinch rollers configured to pinch or grab the copper wire, and another guide connected to a flexible tube.

6. The method of claim 1 , further comprising heating the PCB with a PCB reflow pre-heater mechanism configured to reflow solder once the copper wire is inserted into the hole of the PCB.

7. The method of claim 6 , wherein the pre-heater mechanism includes a hot plate configured to raise a temperature of the PCB to just under a reflow temperature.

8. A method of fabricating a copper vertical launch within a printed circuit board (PCB) using an apparatus comprising a feed mechanism configured to feed and extrude copper wire from a spool of copper wire, and a wire cutting and gripping mechanism configured to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB.

Assignees

• Raytheon Co

Inventors

• Pevzner Mikhail
• Benedict James E
• Southworth Andrew R
• Sikina Thomas V
• Wilder Kevin
• Souza Matthew
• Torberg Aaron Michael

Classifications

• H05K3/4046 Primary

  using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire · CPC title

• B21F11/00

  Cutting wire · CPC title

• H05K3/103 Primary

  by bonding or embedding conductive wires or strips · CPC title

• H05K2203/049

  Wire bonding · CPC title

• H05K2201/10287

  Metal wires as connectors or conductors · CPC title