Method of manufacturing radio frequency interconnections

Patent metadata

Field	Value
Publication number	US-11375609-B2
Application number	US-202017091585-A
Country	US
Kind code	B2
Filing date	Nov 6, 2020
Priority date	Feb 28, 2018
Publication date	Jun 28, 2022
Grant date	Jun 28, 2022

Abstract

A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

First claim

What is claimed is:

1. A method of manufacturing a radio frequency connector, the method comprising:
forming a signal trace from a conductive material disposed on a first substrate, the signal trace including a terminal pad;
bonding a second substrate to the first substrate to substantially encapsulate the trace and terminal pad between the first substrate and the second substrate;
forming an access hole from the second substrate to the terminal pad;
forming a trench through the first and second substrate, the trench being positioned at least partially around the terminal pad;
depositing a conductor into the access hole, the conductor providing an electrical connection to the terminal pad; and
depositing a conductive ink into the trench to form an electrically continuous conductor within the first and second substrate.

2. The method of claim 1 , further comprising depositing a solder bump on the terminal pad.

3. The method of claim 2 , further comprising applying solder reflow process to the conductor to adhere the conductor to the solder bump at the access hole.

4. The method of claim 1 , wherein forming the signal trace includes milling the conductive material disposed on the first substrate.

5. The method of claim 1 , wherein forming the access hole includes drilling through the second substrate.

6. The method of claim 1 , wherein forming the trench includes milling through the first and second substrates.

7. The method of claim 6 , wherein milling through the first and second substrates includes milling to a ground plane substantially without piercing the ground plane.

8. The method of claim 7 , wherein the conductive ink is placed in contact with the ground plane such that the continuous conductor is electrically connected to the ground plane.

Assignees

• Raytheon Co

Inventors

• Sikina Thomas V
• Benedict James E
• Haven John P
• Southworth Andrew R
• Azadzoi Semira M

Classifications

• H05K2201/09236

  Parallel layout · CPC title

• H05K1/0253

  Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K1/0251 takes precedence) · CPC title

• H01P3/085

  Triplate lines · CPC title

• H05K3/368

  parallel to each other (H05K3/361 takes precedence) · CPC title

• H05K3/462

  characterized by laminating only or mainly similar double-sided circuit boards · CPC title