Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw
US-12394697-B2 · Aug 19, 2025 · US
This page is not indexed by search engines while we improve data quality.
Bemmerl Thomas patents
Bemmerl Thomas is listed as an inventor on 42 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bemmerl Thomas |
| Total patents | 42 |
| First publication | Mar 5, 2015 |
| Latest publication | Aug 19, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic devices including vent openings and associated methods
US-12334405-B2 · Jun 17, 2025 · US
Semiconductor Devices and Methods for Manufacturing Thereof
US-2025022780-A1 · Jan 16, 2025 · US
Leadframe comprising a lead with an elevation for increasing mechanical robustness and a semiconductor package
US-2024347427-A1 · Oct 17, 2024 · US
Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw
US-2024186225-A1 · Jun 6, 2024 · US
Semiconductor device package comprising a pin in the form of a drilling screw
US-11955415-B2 · Apr 9, 2024 · US
Semiconductor package and clip with a die attach
US-11869830-B2 · Jan 9, 2024 · US
Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof
US-11869865-B2 · Jan 9, 2024 · US
Package with elevated lead and structure extending vertically from encapsulant bottom
US-11862582-B2 · Jan 2, 2024 · US
Electronic devices including vent openings and associated methods
US-2023420317-A1 · Dec 28, 2023 · US
Recent patents
Latest publications not already listed above.
Semiconductor Packages and Methods for Manufacturing Thereof
US-2023095545-A1 · Mar 30, 2023 · US
Package with elevated lead and structure extending vertically from encapsulant bottom
US-2022165687-A1 · May 26, 2022 · US
Semiconductor Device Package Comprising a Pin in the Form of a Drilling Screw
US-2022005755-A1 · Jan 6, 2022 · US
Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof
US-2021358877-A1 · Nov 18, 2021 · US
Semiconductor device and method for fabricating a semiconductor device
US-11088105-B2 · Aug 10, 2021 · US
Semiconductor package with space efficient lead and die pad design
US-11069600-B2 · Jul 20, 2021 · US
Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier
US-10978378-B2 · Apr 13, 2021 · US
Semiconductor device comprising a composite material clip
US-10971457-B2 · Apr 6, 2021 · US
Semiconductor device with integrated shunt resistor
US-10950509-B2 · Mar 16, 2021 · US
Semiconductor package system
US-10886186-B2 · Jan 5, 2021 · US
Semiconductor Package with Space Efficient Lead and Die Pad Design
US-2020373228-A1 · Nov 26, 2020 · US
Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package
US-10840172-B2 · Nov 17, 2020 · US
Methods for Manufacturing Electronic Devices
US-2020352034-A1 · Nov 5, 2020 · US
Lead Frame Stabilizer for Improved Lead Planarity
US-2020294896-A1 · Sep 17, 2020 · US
Semiconductor Device and Method for Fabricating a Semiconductor Device
US-2020168575-A1 · May 28, 2020 · US
Semiconductor package and clip with a die attach
US-2020152554-A1 · May 14, 2020 · US
Semiconductor device comprising a recess and method of fabricating the same
US-2020051880-A1 · Feb 13, 2020 · US
Cavity based feature on chip carrier
US-2020020649-A1 · Jan 16, 2020 · US
Semiconductor device with integrated shunt resistor and method for producing same
US-2019348333-A1 · Nov 14, 2019 · US
Semiconductor device comprising a composite material clip
US-2019333874-A1 · Oct 31, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 35 |
| Infineon Technologies Austria Ag | 4 |
| Osram Opto Semiconductors Gmbh | 3 |
| Bemmerl Thomas | 1 |
| Jerebic Simon | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 27 |
| H10W74/00 | 22 |
| H10W70/481 | 20 |
| H10W90/736 | 19 |
| H10W72/926 | 18 |