Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier

Patent metadata

Field	Value
Publication number	US-10978378-B2
Application number	US-201816219415-A
Country	US
Kind code	B2
Filing date	Dec 13, 2018
Priority date	Dec 14, 2017
Publication date	Apr 13, 2021
Grant date	Apr 13, 2021

Abstract

A leadless package includes an at least partially electrically conductive carrier having a mounting section and a lead section, an electronic chip mounted on the mounting section, and an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed.

First claim

What is claimed is:

1. A leadless package, comprising:
an at least partially electrically conductive carrier comprising a mounting section and a lead section;
an electronic chip mounted on the mounting section; and
an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed from the encapsulant,
wherein a ratio between a height up to which the interior sidewall of the lead section is exposed from the encapsulant and a thickness of the carrier is at least 20%.

2. The leadless package of claim 1 , wherein the encapsulant partially encapsulates the carrier so that at least two sidewalls of the lead section not forming part of the exterior sidewall of the package are exposed from the encapsulant.

3. The leadless package of claim 1 , wherein the encapsulant partially encapsulates the carrier so that at least part of all sidewalls of the lead section is fully circumferentially exposed from the encapsulant.

4. The leadless package of claim 1 , wherein the lead section comprises a plurality of spaced lead bodies at least one of which has an interior sidewall at least partially exposed from the encapsulant and not forming part of the exterior sidewall of the package.

5. The leadless package of claim 4 , wherein a bottom surface of the encapsulant has at least one recess at least partially exposing at least one interior sidewall of at least one of the lead bodies.

6. The leadless package of claim 5 , wherein:
the at least one recess at least partially surrounds at least part of the lead bodies individually so that spaces between the at least partially exposed interior sidewalls of the lead bodies remain at least partially filled with material of the encapsulant; or
the at least one recess extends only along one of the at least partially exposed interior sidewalls of at least one of the lead bodies; or
the at least one recess at least partially exposes at least part of the lead bodies so that spaces between the at least partially exposed interior sidewalls of the lead bodies are free of material of the encapsulant.

7. The leadless package of claim 4 , wherein at least two of the lead bodies form a continuous integral portion of the carrier and at least one other one of the lead bodies having an interior sidewall at least partially exposed from the encapsulant is separated from the other lead bodies.

8. The leadless package of claim 4 , wherein one of the lead bodies having an interior sidewall at least partially exposed from the encapsulant is located in a corner of the package.

9. The leadless package of claim 4 , wherein at least one of the lead bodies having an interior sidewall at least partially exposed from the encapsulant is located completely in an interior of the package spaced with regard to an exterior lateral surface of the package.

10. The leadless package of claim 1 , wherein an entire bottom surface of the carrier protrudes beyond an entire bottom surface of the encapsulant.

11. The leadless package of claim 1 , wherein:
an exposed bottom surface of the encapsulant is planar; or
an exposed bottom surface of the encapsulant between the mounting section and the lead section is non-planar.

12. An electronic device, comprising:
a mounting base;
a leadless package mounted on the mounting base, the leadless package comprising an at least partially electrically conductive carrier comprising a mounting section and a lead section, an electronic chip mounted on the mounting section, and an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed from the encapsulant; and
a coupling structure electrically and mechanically coupling the package with the mounting base so that the coupling structure contacts at least part of the at least partially exposed interior sidewall of the lead section,
wherein an average thickness of the coupling structure in a lateral direction on the interior sidewall of the lead section facing away from an exterior sidewall of the package is larger than an average thickness of the coupling structure in a lateral direction at the exterior sidewall of the lead section.

13. The electronic device of claim 12 , wherein the coupling structure has an annular section which fully circumferentially contacts at least part of all sidewalls of the lead section at least partially exposed from the encapsulant.

Assignees

• Infineon Technologies Ag

Inventors

• Bemmerl Thomas
• Chan Kuok Wai
• Liebl Christoph
• Tay Bun Kian
• Tay Wee Boon
• Yong Wae Chet

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/534

  being rectangular · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title