Semiconductor package and clip with a die attach

Patent metadata

Field	Value
Publication number	US-11869830-B2
Application number	US-201916678000-A
Country	US
Kind code	B2
Filing date	Nov 8, 2019
Priority date	Nov 9, 2018
Publication date	Jan 9, 2024
Grant date	Jan 9, 2024

Abstract

A clip, a semiconductor package, and a method are disclosed. In one example the clip includes a die attach portion having a first main face and a second main face opposite to the first main face, and at least one through-hole extending between the first and second main faces and including a curved transition from an inner wall of the at least one through-hole to the first main face.

First claim

What is claimed is:

1. A clip comprising:
a die attach portion comprising a first major surface and a second major surface opposite said first major surface, and at least one through hole extending between said first and second major surfaces, wherein said at least one through hole comprises an inner wall and a convex curved transition surface between said inner wall and said first major surface, and wherein said convex curved transition surface has in a lateral cross-section a circular arc segment having a radius R unequal to zero.

2. The clip according to claim 1 , wherein
the non-zero radius R is within a range of 0.05 mm to 0.5 mm.

3. The clip according to claim 1 , wherein
said at least one through hole comprises the shape of at least one elongated slot.

4. The clip according to claim 3 , wherein
said at least one through hole being in the form of two parallel elongate slots.

5. The clip according to claim 1 , comprising:
a base body comprising Cu, a Cu alloy or a composite material comprising Cu and at least one other metal.

6. The clip according to claim 1 , wherein
said at least one through hole having the shape of at least one circle, at least one ellipse, at least one rectangle, at least one rectangle, at least one rectangle with rounded corners, at least one polygon or a composition of the above mentioned shapes.

7. The clip according to claim 1 , comprising:
at least one lead attached to the die attach portion.

8. A clip comprising:
a die attach portion comprising a first major surface and a second major surface opposite said first major surface, and at least one through hole extending between said first and second major surfaces, wherein said at least one through hole comprises an inner wall and a convex curved transition surface between said inner wall and said first major surface, and wherein said convex curved transition surface has in a lateral cross-section a circular arc segment having a radius R unequal to zero; and
a plurality of leads attached to the die attach portion.

9. The clip according to claim 8 , wherein
the non-zero radius R is within a range of 0.05 mm to 0.5 mm.

10. The clip according to claim 8 , wherein
said at least one through hole comprises the shape of at least one elongated slot.

11. The clip according to claim 10 , wherein
said at least one through hole being in the form of two parallel elongate slots.

12. The clip according to claim 8 , comprising:
a base body comprising Cu, a Cu alloy or a composite material comprising Cu and at least one other metal.

13. The clip according to claim 8 , wherein
said at least one through hole having the shape of at least one circle, at least one ellipse, at least one rectangle, at least one rectangle, at least one rectangle with rounded corners, at least one polygon or a composition of the above mentioned shapes.

14. A clip comprising:
a die attach portion comprising a first major surface and a second major surface opposite said first major surface, and at least one through hole extending between said first and second major surfaces, wherein an edge between an inner wall of said at least one through hole and said first major surface has a curved transition having in a lateral cross-section a circular arc segment having a radius R unequal to zero; and
a plurality of leads attached to the die attach portion,
wherein said at least one through hole comprises the shape of at least one elongated slot, and
wherein said at least one through hole being in the form of two parallel elongate slots.

15. The clip according to claim 14 wherein
the curved transition comprises a curved convex transition.

16. The clip according to claim 14 , wherein
the non-zero radius R is within a range of 0.05 mm to 0.5 mm.

17. The clip according to claim 14 , comprising:
a base body comprising Cu, a Cu alloy or a composite material comprising Cu and at least one other metal.

Assignees

• Infineon Technologies Ag

Inventors

• Stadler Michael
• Bemmerl Thomas

Classifications

• H10W72/07336

  Soldering or alloying · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W70/457

  of metallic layers on leadframes · CPC title

• H10W70/421

  Shapes or dispositions · CPC title

• H10W70/042

  Etching · CPC title