Leadframe package with adjustable clip
US-2022189855-A1 · Jun 16, 2022 · US
Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof
US11869865B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11869865-B2 |
| Application number | US-202117389721-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2021 |
| Priority date | Nov 28, 2018 |
| Publication date | Jan 9, 2024 |
| Grant date | Jan 9, 2024 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A semiconductor device includes: a carrier having a die pad and a contact; a semiconductor die having opposing first and second main sides and being attached to the die pad by a first solder joint such that the second main side faces the die pad; and a contact clip having a first contact region and a second contact region. The first contact is attached to the first main side by a second solder joint. The second contact region is attached to the contact by a third solder joint. The first contact region has a convex shape facing towards the first main side such that a distance between the first main side and the first contact region increases from a base of the convex shape towards an edge of the first contact region. The base runs along a line that is substantially perpendicular to a longitudinal axis of the contact clip.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device, comprising: a carrier comprising a die pad and a contact; a semiconductor die comprising a first main side and an opposing second main side, the semiconductor die being attached to the die pad by a first solder joint such that the second main side faces the die pad; and a contact clip comprising a first contact region and a second contact region, the first contact region being attached to the first main side of the semiconductor die by a second solder joint and the second contact region being attached to the contact by a third solder joint, wherein the first contact region has a convex shape facing towards the first main side of the semiconductor die such that a distance between the first main side and the first contact region increases from a base of the convex region towards an edge of the first contact region, wherein the base runs along a line that runs substantially perpendicular to a longitudinal axis of the contact clip. 2. The semiconductor device of claim 1 , wherein the distance monotonically increases from the base towards the edge. 3. The semiconductor device of claim 2 , wherein the distance monotonically increases continuously from the base towards the edge. 4. The semiconductor device of claim 1 , wherein the line coincides with a center axis of the semiconductor die within a margin of error of 200 μm or less. 5. The semiconductor device of claim 1 , wherein the second contact region of the contact clip comprises a bent-down end portion comprising a cut surface, and wherein the cut surface faces the contact. 6. The semiconductor device of claim 1 , wherein the first contact region and the second contact region of the contact clip are straight. 7. The semiconductor device of claim 1 , wherein the first solder joint is flat such that a vertical distance of the second main side of the semiconductor die to the die pad is within a margin of error of 15 μm or less.
Assignees
Inventors
Classifications
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
Packaging processes not covered by the other groups of this subclass · CPC title
Soldering or alloying · CPC title
Cross-sectional shape · CPC title
Shapes of strap connectors · CPC title
Patent family
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Frequently asked questions
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- What does patent US11869865B2 cover?
- A semiconductor device includes: a carrier having a die pad and a contact; a semiconductor die having opposing first and second main sides and being attached to the die pad by a first solder joint such that the second main side faces the die pad; and a contact clip having a first contact region and a second contact region. The first contact is attached to the first main side by a second solder …
- Who is the assignee on this patent?
- Infineon Technologies Ag
- What technology area does this patent fall under?
- Primary CPC classification H10W72/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).