Semiconductor devices and related methods
US-12581975-B2 · Mar 17, 2026 · US
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Bang Won Bae patents
Bang Won Bae is listed as an inventor on 58 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bang Won Bae |
| Total patents | 58 |
| First publication | Mar 1, 2016 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device and manufacturing method thereof
US-12550766-B2 · Feb 10, 2026 · US
Semiconductor devices and methods of manufacturing semiconductor devices
US-2025069962-A1 · Feb 27, 2025 · US
Semiconductor package having routable encapsulated conductive substrate and method
US-2024404902-A1 · Dec 5, 2024 · US
Semiconductor device and manufacturing method thereof
US-2024363506-A1 · Oct 31, 2024 · US
Semiconductor package having routable encapsulated conductive substrate and method
US-12062588-B2 · Aug 13, 2024 · US
Method of forming a molded substrate electronic package and structure
US-2024258225-A1 · Aug 1, 2024 · US
Semiconductor devices and related methods
US-2024258182-A1 · Aug 1, 2024 · US
Semiconductor devices and related methods
US-11961775-B2 · Apr 16, 2024 · US
Method of forming a molded substrate electronic package and structure
US-11961794-B2 · Apr 16, 2024 · US
Recent patents
Latest publications not already listed above.
Electronic devices and methods of manufacturing electronic devices
US-2024112975-A1 · Apr 4, 2024 · US
Semiconductor device and manufacturing method thereof
US-11923280-B2 · Mar 5, 2024 · US
Semiconductor device and method of manufacturing a semiconductor device
US-2023352370-A1 · Nov 2, 2023 · US
Method of forming a molded substrate electronic package and structure
US-2023240457-A9 · Aug 3, 2023 · US
Semiconductor device having a lead flank and method of manufacturing a semiconductor device having a lead flank
US-11646248-B2 · May 9, 2023 · US
Semiconductor package having routable encapsulated conductive substrate and method
US-2023083412-A1 · Mar 16, 2023 · US
Semiconductor devices and related methods
US-2023070922-A1 · Mar 9, 2023 · US
Method for fabricating semiconductor package and semiconductor package using the same
US-11569163-B2 · Jan 31, 2023 · US
Semiconductor package having routable encapsulated conductive substrate and method
US-11508635-B2 · Nov 22, 2022 · US
Semiconductor devices and related methods
US-11495505-B2 · Nov 8, 2022 · US
Semiconductor devices and related methods
US-11398455-B2 · Jul 26, 2022 · US
Semiconductor device having a lead flank and method of manufacturing a semiconductor device having a lead flank
US-2022216132-A1 · Jul 7, 2022 · US
Method for fabricating semiconductor package and semiconductor package using the same
US-2022130749-A1 · Apr 28, 2022 · US
Semiconductor device and manufacturing method thereof
US-2021398888-A1 · Dec 23, 2021 · US
Method for fabricating semiconductor package and semiconductor package using the same
US-11145588-B2 · Oct 12, 2021 · US
Semiconductor device and manufacturing method thereof
US-11114369-B2 · Sep 7, 2021 · US
Method of forming a molded substrate electronic package and structure
US-2021106156-A1 · Apr 15, 2021 · US
Method of forming a molded substrate electronic package and structure
US-10910298-B2 · Feb 2, 2021 · US
Semiconductor devices and related methods
US-2020411397-A1 · Dec 31, 2020 · US
Semiconductor device and method of manufacturing a semiconductor device
US-2020395272-A1 · Dec 17, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Amkor Tech Singapore Holding Pte Ltd | 33 |
| Amkor Technology Inc | 30 |
| Amikor Tech Singapore Holding Pte Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/117 | 44 |
| H10W70/479 | 42 |
| H10W74/00 | 41 |
| H10W90/724 | 40 |
| H10W70/635 | 38 |