Composition for tin-silver alloy electroplating comprising a complexing agent
US-12559852-B2 · Feb 24, 2026 · US
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Arnold Marco patents
Arnold Marco is listed as an inventor on 48 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Arnold Marco |
| Total patents | 48 |
| First publication | Oct 8, 2015 |
| Latest publication | Feb 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Polyalkanolamines
US-12522936-B2 · Jan 13, 2026 · US
Composition for tin or tin alloy electroplating comprising leveling agent
US-2026002280-A1 · Jan 1, 2026 · US
Composition for tin or tin alloy electroplating comprising leveling agent
US-12509790-B2 · Dec 30, 2025 · US
Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition
US-2025388725-A1 · Dec 25, 2025 · US
Epoxy resin composition
US-12428520-B2 · Sep 30, 2025 · US
Composition for copper electrodeposition comprising a polyaminoamide type leveling agent
US-2025129503-A1 · Apr 24, 2025 · US
Composition for tin or tin alloy electroplating comprising a pyrazole-type antioxidant
US-2025011961-A1 · Jan 9, 2025 · US
Detection of the oxidation progress of metal condensate
US-2025001502-A1 · Jan 2, 2025 · US
Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent
US-12134834-B2 · Nov 5, 2024 · US
Recent patents
Latest publications not already listed above.
Composition for cobalt plating comprising additive for void-free submicron feature filling
US-12098473-B2 · Sep 24, 2024 · US
Composition for tin-silver alloy electroplating comprising a complexing agent
US-12054842-B2 · Aug 6, 2024 · US
Composition for metal plating comprising suppressing agent for void free filing
US-11926918-B2 · Mar 12, 2024 · US
Composition for tin-silver alloy electroplating comprising a complexing agent
US-2024060201-A1 · Feb 22, 2024 · US
Composition for tin or tin alloy electroplating comprising leveling agent
US-2024052515-A1 · Feb 15, 2024 · US
Composition for tin or tin alloy electroplating comprising suppressing agent
US-11840771-B2 · Dec 12, 2023 · US
Polyalkanolamines
US-2023235471-A1 · Jul 27, 2023 · US
Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent
US-2023142238-A1 · May 11, 2023 · US
Epoxy resin composition
US-2023134713-A1 · May 4, 2023 · US
Composition for cobalt or cobalt alloy electroplating
US-11585004-B2 · Feb 21, 2023 · US
Composition for tin or tin alloy electroplating comprising leveling agent
US-11535946-B2 · Dec 27, 2022 · US
Composition for copper bump electrodeposition comprising a leveling agent
US-2022356592-A1 · Nov 10, 2022 · US
Composition for metal electroplating comprising leveling agent
US-11486049-B2 · Nov 1, 2022 · US
Composition for copper bump electrodeposition comprising a leveling agent
US-2022333262-A1 · Oct 20, 2022 · US
Composition for tin or tin alloy electroplating comprising suppressing agent
US-11459665-B2 · Oct 4, 2022 · US
Composition for Cobalt Electroplating Comprising Leveling Agent
US-2022298664-A1 · Sep 22, 2022 · US
Composition for metal electroplating comprising leveling agent
US-11387108-B2 · Jul 12, 2022 · US
Composition for cobalt electroplating comprising leveling agent
US-11377748-B2 · Jul 5, 2022 · US
Composition for tin or tin alloy electroplating comprising suppressing agent
US-2022119972-A1 · Apr 21, 2022 · US
Composition for tin or tin alloy electroplating comprising suppressing agent
US-11242606-B2 · Feb 8, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Basf Se | 47 |
| Roeger-Goepfert Cornelia | 4 |
| Raether Roman Benedikt | 4 |
| Arnold Marco | 4 |
| Emnet Charlotte | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.