Composition for tin or tin alloy electroplating comprising suppressing agent

Patent metadata

Field	Value
Publication number	US-11459665-B2
Application number	US-201816954333-A
Country	US
Kind code	B2
Filing date	Dec 10, 2018
Priority date	Dec 20, 2017
Publication date	Oct 4, 2022
Grant date	Oct 4, 2022

Abstract

Described herein is an aqueous composition including tin ions and at least one compound of formula IwhereX1, X2 are independently selected from a linear or branched C1-C12 alkanediyl,R11 is a monovalent group of formula —(O—CH2—CHR41)m—OR42,R12, R13, R14 are independently selected from H, R11, and R40;R15 is selected from H, R11, R40 and —X4—N(R21)2,X4 is a divalent group selected from (a) a linear or branched C1 to C12 alkanediyl, and (b) formula —(O—CH2—CHR41)o—,R21 is selected from R11 and R40,R40 is a linear or branched C1-C20 alkyl,R41 is selected from H and a linear or branched C1 to C5 alkyl,R42 is selected from H and a linear or branched C1-C20 alkyl,n is an integer of from 1 to 6,m is an integer of from 2 to 250, ando is an integer of from 1 to 250.

First claim

The invention claimed is:

1. An aqueous composition comprising tin ions and at least one compound of formula I

wherein
X 1 , X 2 are independently selected from a linear or branched C 1 -C 12 alkanediyl, which may optionally be interrupted by O or S,
R 11 is a monovalent group of formula —(O—CH 2 —CHR 41 ) m —OR 42 ,
R 12 , R 13 , R 14 are independently selected from H, R 11 , and R 40 ;
R 15 is selected from H, R 11 , R 40 and —X 4 —N(R 21 ) 2 ,
X 4 is a divalent group selected from (a) a linear or branched C 1 to C 12 alkanediyl, and (b) formula —(O—CH 2 —CHR 41 ) o —,
R 21 is selected from R 11 and R 40 ,
R 40 is a linear or branched C 1 -C 20 alkyl,
R 41 is selected from H and a linear or branched C 1 to C 5 alkyl,
R 42 is selected from H and a linear or branched C 1 -C 20 alkyl, which may optionally be substituted by hydroxy, alkoxy or alkoxycarbonyl,
n is an integer of from 1 to 6,
m is an integer of from 2 to 250, and
o is an integer of from 1 to 250,
wherein the aqueous composition is free of copper ions.

2. The aqueous composition according to claim 1 , wherein X 1 and X 2 are independently selected from a C 1 to C 6 alkanediyl.

3. The aqueous composition according to claim 1 , wherein X 1 and X 2 are each independently —(CHR 41 ) q -[Q-(CHR 41 ) r ] s —, wherein Q is selected from O or S, and wherein q+r·s is the number of C atoms.

4. An aqueous composition according to claim 3 , wherein Q=O and q=r=1 or 2.

5. The aqueous composition according to claim 1 , wherein R 41 is selected from H, methyl and ethyl.

6. The aqueous composition according to claim 1 , wherein R 12 , R 13 and R 14 are each independently R 11 .

7. The aqueous composition according to claim 1 , wherein R 15 is selected from R 11 and —X 4 —N(R 21 ) 2 .

8. The aqueous composition according to claim 1 , wherein R 11 is a copolymer of ethylene oxide and a further C 3 to C 4 alkylene oxide.

9. The aqueous composition according to claim 8 , wherein the content of ethylene oxide in the copolymer of ethylene oxide and the further C 3 to C 4 alkylene oxide is from 5 to 50% by weight.

10. The aqueous composition according to claim 8 , wherein the content of ethylene oxide in the copolymer of ethylene oxide and the further C 3 to C 4 alkylene oxide is from 5 to 30% by weight.

11. The aqueous composition according to claim 1 , which comprises a single grain refiner that is not a ****** unsaturated aliphatic carbonyl compound.

12. The aqueous composition according to claim 1 , which comprises essentially no grain refiner.

13. The aqueous composition according to claim 1 , wherein X 1 and X 2 are independently selected from the group consisting of methanediyl, ethanediyl, and propanediyl.

14. The aqueous composition according to claim 1 , wherein R 41 is selected from H and methyl.

15. The aqueous composition according to claim 8 , wherein the content of ethylene oxide in the copolymer of ethylene oxide and the further C 3 to C 4 alkylene oxide is from 5 to 40% by weight.

16. The aqueous composition according to claim 8 , wherein the content of ethylene oxide in the copolymer of ethylene oxide and the further C 3 to C 4 alkylene oxide is from 8 to 20% by weight.

17. A method of using the aqueous composition according to claim 1 , the method comprising using the aqueous composition for depositing tin or tin alloys on a substrate comprising features having an aperture size from 500 nm to 500 μm.

18. A process for electrodepositing tin or a tin alloy onto a substrate by
a) contacting a composition comprising tin ions and at least one compound of formula I with the substrate,

wherein
X 1 , X 2 are independently selected from a linear or branched C 1 -C 12 alkanediyl, which may optionally be interrupted by O or S,
R 11 is a monovalent group of formula —(O—CH 2 —CHR 41 ) m —OR 42 ,
R 12 , R 13 , R 14 are independently selected from H, R 11 , and R 40 ;
R 15 is selected from H, R 11 , R 40 and —X 4 —N(R 21 ) 2 ,
X 4 is a divalent group selected from (a) a linear or branched C 1 to C 12 alkanediyl, and (b) formula —(O—CH 2 —CHR 41 ) o —,
R 21 is selected from R 11 and R 40 ,
R 40 is a linear or branched C 1 -C 20 alkyl,
R 41 is selected from H and a linear or branched C 1 to C 5 alkyl,
R 42 is selected from H and a linear or branched C 1 -C 20 alkyl, which may optionally be substituted by hydroxy, alkoxy or alkoxycarbonyl,
n is an integer of from 1 to 6,
m is an integer of from 2 to 250, and
o is an integer of from 1 to 250,
and
b) applying a current to the substrate for a time sufficient to deposit a tin or tin alloy layer onto the substrate,
wherein the substrate comprises features having an aperture size from 500 nm to 500 μm and the deposition is performed to fill these features.

19. The process according to claim 18 , wherein the aperture size is from 1 μm to 200 μm.

Assignees

• Basf Se

Inventors

• Fluegel Alexander
• Arnold Marco
• Kienle Marcel Patrik
• Engelhardt Nadine

Classifications

• C25D3/60

  containing more than 50% by weight of tin · CPC title

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title

• C25D5/02

  Electroplating of selected surface areas · CPC title

• C25D3/32 Primary

  characterised by the organic bath constituents used · CPC title