Epoxy resin composition

Patent metadata

Field	Value
Publication number	US-12428520-B2
Application number	US-202117913179-A
Country	US
Kind code	B2
Filing date	Mar 24, 2021
Priority date	Mar 26, 2020
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

The present invention relates to a resin composition, comprising (a) an epoxy resin; (b) a curing agent comprising the structure of formula C1; (c) an inorganic filler; wherein R C1 is (a) a siloxane group of formula C1a or (b) or both a siloxane group of formula C1a and an ester group of formula C1b; R C2 is selected from a bulky C 4 to C 12 alkyl group comprising at least one tertiary or quaternary carbon atom; R C11 , R C12 , R C13 are independently selected from methyl, ethyl and 1-propyl; R C14 is selected from a linear or branched C 1 to C 8 alkyl; X C1 is selected from a divalent C 1 to C 4 alkanediyl group; and n is an average number of repeating units and is from 1.05 to 200.

First claim

The invention claimed is:

1. A compound of formula C2

wherein
each instance of R C1 is independently selected from
a siloxane group of formula C1a

and an ester group of formula C1b

wherein at least one R C1 is the siloxane group of formula C1a;
R C2 is selected from a bulky C 4 to C 12 alkyl group comprising at least one tertiary or quaternary carbon atom;
R C11 , R C12 , R C13 are independently selected from methyl, ethyl and 1-propyl;
R C14 is selected from a linear or branched C 1 to C 8 alkyl;
and
n is an average number of repeating units and is from 1.05 to 200.

2. The compound according to claim 1 , wherein R C2 is a C 4 to C 8 branched alkyl group.

3. The compound according to claim 2 , wherein R C2 is t-butyl; 1,1-dimethyl propyl; 2,2-dimethyl propyl; 2,2-dimethyl butyl; 3,3-dimethyl butyl; or 1,1,3,3-tetramethyl butyl.

4. The compound according to claim 1 , wherein n is from 1.5 to 500.

5. The compound according to claim 1 , wherein the weight average molecular weight is from 400 to 5 000 g/mol.

6. A resin composition, comprising
(a) an epoxy resin;
(b) a curing agent that is a compound according to claim 1 ; and
(c) an inorganic filler.

7. The resin composition according to claim 6 , wherein the composition further comprises an ester-type curing agent of formula C1,

wherein R C1 is an ester group of formula C1b

wherein R C14 is selected from a linear or branched C 1 to C 8 alkyl, or a branched C 3 to C 8 alkyl;
X C1 is selected from a divalent C 1 to C 4 alkanediyl group;
R C2 is selected from a bulky C 4 to C 20 alkyl group comprising at least one tertiary or quaternary carbon atom;
and
n is an average number of repeating units and is from 1.05 to 200.

8. The resin composition according to claim 6 , wherein the inorganic filler consists of silica.

9. A method comprising providing the resin composition according to claim 8 and depositing an insulating film on a circuit substrate.

10. An insulating layer comprising the resin composition according to claim 8 , after curing said resin composition to form an insulating layer, wherein the insulating layer has a dielectric resistance D k of 3 or below and a loss tangent D f of 0.02 or below.

Assignees

• Basf Se

Inventors

• Yu Miran
• Scherr Guenter
• Arnold Marco
• Mayer Dieter
• Pawar Madhura Shreekar

Classifications

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/621 Primary

  Phenols · CPC title

• C08G59/3218

  Carbocyclic compounds · CPC title

• C08K3/36

  Silica · CPC title

• C08G59/4085 Primary

  silicon containing compounds · CPC title