Composition for metal plating comprising suppressing agent for void free submicron feature filling
US-9869029-B2 · Jan 16, 2018 · US
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Emnet Charlotte patents
Emnet Charlotte holds 7 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 7 |
| Recent patents | 0 |
| First publication | Apr 21, 2015 |
| Latest publication | Jan 16, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Composition for metal electroplating comprising leveling agent
US-9834677-B2 · Dec 5, 2017 · US
Composition for metal electroplating comprising leveling agent
US-9683302-B2 · Jun 20, 2017 · US
Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
US-9631292-B2 · Apr 25, 2017 · US
Composition for metal plating comprising suppressing agent for void free submicron feature filling
US-9617647-B2 · Apr 11, 2017 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Composition for metal plating comprising suppressing agent for void free submicron feature filling
US-9869029-B2 · Jan 16, 2018 · US
Composition for metal electroplating comprising leveling agent
US-9834677-B2 · Dec 5, 2017 · US
Composition for metal electroplating comprising leveling agent
US-9683302-B2 · Jun 20, 2017 · US
Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
US-9631292-B2 · Apr 25, 2017 · US
Composition for metal plating comprising suppressing agent for void free submicron feature filling
US-9617647-B2 · Apr 11, 2017 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Chemistry & Metallurgy | 7 |
| Electricity | 5 |