Epoxy resin composition

Patent metadata

Field	Value
Publication number	US-2023134713-A1
Application number	US-202117913179-A
Country	US
Kind code	A1
Filing date	Mar 24, 2021
Priority date	Mar 26, 2020
Publication date	May 4, 2023
Grant date	—

Abstract

The present invention relates to a resin composition, comprising (a) an epoxy resin; (b) a curing agent comprising the structure of formula C1; (c) an inorganic filler; wherein R C1 is (a) a siloxane group of formula C1a or (b) or both a siloxane group of formula C1a and an ester group of formula C1b; R C2 is selected from a bulky C 4 to C 12 alkyl group comprising at least one tertiary or quaternary carbon atom; R C11 , R C12 , R C13 are independently selected from methyl, ethyl and 1-propyl; R C14 is selected from a linear or branched C 1 to C 8 alkyl; X C1 is selected from a divalent C 1 to C 4 alkanediyl group; and n is an average number of repeating units and is from 1.05 to 200.

First claim

1 - 12 . (canceled)

13 . A compound of formula C2

wherein
R C1 is
(a) a siloxane group of formula C1a

or (b) or both a siloxane group of formula C1a and an ester group of formula C1b

R C2 is selected from a bulky C 4 to C 12 alkyl group comprising at least one tertiary or quaternary carbon atom;
R C11 , R C12 , R C13 are independently selected from methyl, ethyl and 1-propyl;
R C14 is selected from a linear or branched C 1 to C 8 alkyl;
X C1 is selected from a divalent C 1 to C 4 alkanediyl group; and
n is an average number of repeating units and is from 1.05 to 200.

14 . The compound according to claim 13 , wherein R C2 is a C 4 to C 8 branched alkyl group.

15 . The compound according to claim 14 , wherein R C2 is t-butyl; 1,1-dimethyl propyl; 2,2-dimethyl propyl; 2,2-dimethyl butyl; 3,3-dimethyl butyl; or 1,1,3,3-tetramethyl butyl.

16 . The compound according to claim 13 , wherein n is from 1.5 to 500.

17 . The compound according to claim 13 , wherein the weight average molecular weight is from 400 to 5 000 g/mol.

18 . A resin composition, comprising
(a) an epoxy resin; (b) a curing agent that is a compound according to claim 13 ; and (c) an inorganic filler.

19 . The resin composition according to claim 17 , wherein the composition further comprises an ester-type curing agent of formula C1, wherein R C1 is an ester group of formula C1b

wherein R C14 is selected from a linear or branched C 1 to C 8 alkyl, or a branched C 3 to C 8 alkyl.

20 . The resin composition according to claim 13 , wherein the inorganic filler consists of silica.

21 . A method comprising providing the resin composition according to claim 20 and depositing an insulating film on a circuit substrate.

22 . An insulating layer comprising the resin composition according to claim 20 , after curing said resin composition to form an insulating layer, wherein the insulating layer has a dielectric resistance D k of 3 or below and a loss tangent D f of 0.02 or below.

Assignees

• Basf Se

Inventors

• Yu Miran
• Scherr Guenter
• Arnold Marco
• Mayer Dieter
• Pawar Madhura Shreekar

Classifications

• C08G59/621 Primary

  Phenols · CPC title

• C08G59/3218

  Carbocyclic compounds · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/4085 Primary

  silicon containing compounds · CPC title

• C08K3/36

  Silica · CPC title