Antimicrobial polymers formed by bulk polyaddition
US-2016374335-A1 · Dec 29, 2016 · US
US12522936B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12522936-B2 |
| Application number | US-202118001078-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 7, 2021 |
| Priority date | Jun 10, 2020 |
| Publication date | Jan 13, 2026 |
| Grant date | Jan 13, 2026 |
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Disclosed herein is a A polyalkanolamine including the structure of formula L1 [A L ] n [B L ] m (L1) wherein X L1 , X L2 , X L3 are independently selected from a C 1 to C 6 alkanediyl; Ar L is a 5 or 6 membered N-heteroaromatic ring system including from 1 to 4 N atoms, which may be unsubstituted or substituted by C 1 to C 6 alkyl; n is an integer of from 2 to 350; m is 0 or an integer of from 1 to 600; o is 1 or an integer of from 2 to 25; B L1 is a continuation of the backbone B L by branching; X L11 , X L12 , X L13 are independently selected from a C 1 to C 6 alkanediyl; X L21 is a C 1 to C 6 alkanediyl; and derivatives thereof obtainable by N-protonation, N-quaternization, substitution, or polyalkoxylation.
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The invention claimed is: 1 . A polyalkanolamine comprising the structure of formula L1 [A L ] n [B L ] m (1) wherein X L1 , X L2 , X L3 are independently selected from the group consisting of C 1 to C 6 alkanediyl; Ar L is a monovalent 5 or 6 membered N-heteroaromatic ring system comprising from 1 to 4 N atoms, which ring system may be unsubstituted or substituted by C 1 to C 6 alkyl; n is an integer of from 2 to 350; m is 0 or an integer of from 1 to 600; o is 1 or an integer of from 2 to 25; B L1 is a continuation of the backbone B L by branching; R L33 is H or a C 1 to C 6 alkyl; X L11 , X L12 , X L13 are independently selected from the group consisting of C 1 to C 6 alkanediyl; X L21 is a C 1 to C 8 alkanediyl; and derivatives thereof obtainable by N-protonation, N-quaternization, N- or O-substitution, or N- or O-alkoxylation. 2 . The polyalkanolamine according to claim 1 , wherein the additive is a compound of formula L2 R L1 -[A L ] n [B L ] m —OR L2 (L2) wherein R L1 and R L2 are termination groups. 3 . The polyalkanolamine according to claim 1 , wherein Ar L is selected from the group consisting of imidazole-1-yl and pyridyl. 4 . The polyalkanolamine according to claim 1 , wherein X L1 , X L2 , and X L3 , and if applicable X L11 , X L12 , and X L13 are independently selected from the group consisting of methanediyl, ethane-1,2-diyl, propane-1,3-diyl, propane-1,2-diyl, 2-methylpropane-1,2-diyl, 2,2-dimethylpropane-1,3-diyl, butane-1,4-diyl, butane-1,3-diyl, butane-1,2-diyl, butane-2,3-diyl, 2-methylbutane-1,3-diyl, 3-methylbutane-1,3-diyl, pentane-1,2-diyl, pentane-1,5-diyl, pentane-2,5-diyl, 2-methylpentane-2,5-diyl and hexane-1,6-diyl. 5 . The polyalkanolamine according to claim 1 , wherein m is 0. 6 . The polyalkanolamine according to claim 5 , wherein all fragments [A L ] in the polyalkanolamine of formula [A L ] n are the same. 7 . The polyalkanolamine according to claim 5 , wherein the polyalkanolamine is a compound of formula L11 wherein R L1 , R L2 are independently selected from the group consisting of H, C 1 to C 6 alkyl, polyoxy(C 2 -C 12 )alkylene, sulfate, sulfonate, phosphate, and phosphonate. 8 . The polyalkanolamine according to claim 1 , wherein m is an integer of from 3 to 250 and B L is selected from the group consisting of —[X L21 —O] o —. 9 . The polyalkanolamine according to claim 8 , wherein the polyalkanolamine is a compound of formula L12 wherein o is an integer from 2 to 20; R L1 , R L2 are independently selected from the group consisting of H, methyl, ethyl, propyl and butyl; R L31 is H, methyl, ethyl or propyl. 10 . The polyalkanolamine according to claim 1 , wherein the polyalkanolamine is a compound of formula L13 wherein z is an integer of from 1 to 8; R L1 , R L2 are independently selected from the group consisting of H, methyl, ethyl, propyl and butyl; and R L31 is H, methyl, ethyl or propyl. 11 . The polyalkanolamine according to claim 1 , wherein the polyalkanolamine is a compound of formula L14 wherein R L1 , R L2 are independently selected from the group consisting of H, methyl, ethyl, propyl or butyl. 12 . A composition for copper electroplating comprising copper ions and at least one polyalkanolamine according to claim 1 . 13 . The composition according to claim 12 , wherein the pH is from 0 to 5. 14 . The composition according to claim 12 , further comprising one or more accelerating agents, one or more suppressing agents, or a combination thereof. 15 . A method of using the composition according to claim 12 , the method comprising using the composition for depositing copper on a substrate comprising a recessed feature comprising a conductive feature bottom and a dielectric feature side wall, wherein the recessed feature has an aperture size from 500 nm to 500 μm. 16 . A process for electrodepositing copper on a substrate comprising a recessed feature comprising a conductive feature bottom and a dielectric feature side wall, the process comprising: a) contacting a composition according to claim 12 with the substrate, and b) applying a current to the substrate for a time sufficient to deposit a copper layer into the recessed feature, wherein the recessed feature has an aperture size from 500 nm to 500 μm. 17 . The polyalkanolamine according to claim 1 , wherein the additive is a compound of formula L2 R L1 -[A L ] n [B L ] m —OR L2 (L2) wherein R L1 and R L2 are termination groups selected from the group consisting of H, C 1 to C 6 alkyl, polyoxy(C 2 -C 12 )alkylene, sulfate, sulfonate, phosphate, and phosphonate. 18 . The polyalkanolamine according to claim 8 , wherein the polyalkanolamine is a compound of formula L12 wherein o is an integer from 2 to 20; R L1 , R L2 is H; R L31 is H. 19 . The polyalkanolamine according to claim 1 , wherein the polyalkanolamine is a compound of formula L13 wherein z is an integer of from 1 to 8; R L1 , R L2 is H; and R L31 is H. 20 . The polyalkanolamine according to claim 1 , wherein the polyalkanolamine is a compound of formula L14 wherein R L1 , R L2 are each H.
Semiconductors · CPC title
Copper · CPC title
Five-membered rings · CPC title
Metals · CPC title
Polyamines containing oxygen in the form of ether bonds in the main chain · CPC title
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