Composition for tin or tin alloy electroplating comprising suppressing agent

Patent metadata

Field	Value
Publication number	US-11840771-B2
Application number	US-202117566426-A
Country	US
Kind code	B2
Filing date	Dec 30, 2021
Priority date	Apr 20, 2018
Publication date	Dec 12, 2023
Grant date	Dec 12, 2023

Abstract

Described herein is an aqueous composition including tin ions and at least one compound of formula I

wherein
X 1 is selected from a linear or branched C 1 -C 12 alkanediyl, which may optionally be interrupted by O or S or a C 5 to C 12 aromatic moiety,
R 11 is a copolymer of ethylene oxide and a further C 3 to C 6 alkylene oxide, wherein the content of ethylene oxide is from 5 to 30% by weight,
R 11 is selected from H, R 11 , R 40 ,
R 13 , R 14 are (a) independently selected from H, R 11 , R 40 , or (b) may together form a divalent group X 13 ;
X 13 is selected from a linear or branched C 1 -C 12 alkanediyl, which may optionally be
interrupted by O, S or NR 43 ;
R 40 is H or a linear or branched C 1 -C 20 alkyl,
R 43 is selected from H, R 11 and a linear or branched C 1 -C 20 alkyl.

First claim

The invention claimed is:

1. An aqueous composition comprising tin ions and at least one compound of formula I

wherein
X 1 is selected from a linear or branched C 1 -C 12 alkanediyl, which may optionally be interrupted by O or S,
R 11 is a copolymer of ethylene oxide and a further C 3 to C 6 alkylene oxide, wherein the content of ethylene oxide is from 5 to 30% by weight,
R 12 is selected from H, R 11 , R 40 ,
R 13 , R 14 are (a) independently selected from H, R 11 , R 40 , or (b) may together form a divalent group X 13 ;
X 13 is selected from a linear or branched C 1 -C 12 alkanediyl, which may optionally be interrupted by O, S or NR 43 ;
R 40 is H or a linear or branched C 1 -C 20 alkyl,
R 43 is selected from H, R 11 and a linear or branched C 1 -C 20 alkyl wherein the aqueous composition is essentially free of copper ions and comprises essentially no grain refiner.

2. The aqueous composition according to claim 1 , wherein X 1 is selected from a C 1 -C 6 alkanediyl, preferably methanediyl, ethanediyl or propanediyl.

3. The aqueous composition according to claim 1 , wherein X 1 is —(CHR 42 ) u —Y—(CHR 42 ) Y —, wherein Y is a divalent aromatic moiety, preferably phenylen, u and v are integers from 1 to 6, and R 42 is independently selected from C 1 to C 4 alkyl, preferably from methanediyl and ethanediyl.

4. The aqueous composition according to claim 1 , wherein X 1 is —(CHR 41 ) q -[Q-(CHR 41 ) r ] s —, wherein Q is selected from O, S wherein q+r·s is the number of C atoms in the spacer and R 41 is H or a linear or branched C 1 -C 20 alkyl.

5. An aqueous composition according to claim 4 , wherein Q═O and q and r are 1 or 2.

6. The aqueous composition according to claim 1 , wherein R 12 , R 13 and R 14 are selected from R 11 .

7. The aqueous composition according to claim 1 , wherein X 13 is selected from a linear or branched C 1 -C 6 alkanediyl, preferably from methanediyl, ethanediyl or propanediyl.

8. The aqueous composition according to claim 7 , wherein X 1 is selected so as to form a 5 or 6 membered ring system.

9. The aqueous composition according to claim 7 , wherein R 43 is selected from H, R 11 and a linear or branched C 1 -C 10 alkyl, preferably from H, R 11 and a linear or branched C 1 -C 6 alkyl.

10. The aqueous composition according to claim 1 , wherein R 11 is a copolymer of ethylene oxide and propylene oxide.

11. The aqueous composition according to claim 1 , wherein the content of ethylene oxide in the copolymer of ethylene oxide and the further C 3 to C 4 alkylene oxide is from 10 to 25% by weight, preferably from 11 to 24% by weight.

12. The aqueous composition according to claim 1 , which comprises a single grain refiner that is no α,β-unsaturated aliphatic carbonyl compound.

13. A method for depositing tin or tin alloys on a substrate comprising features having an aperture size from 500 nm to 500 μm, the method comprising:
contacting the substrate with the aqueous composition of claim 1 .

14. A process for electrodepositing tin or a tin alloy onto a substrate by
a) contacting a composition according to claim 1 with the substrate, and
b) applying a current to the substrate for a time sufficient to deposit a tin or tin alloy layer onto the substrate,
wherein the substrate comprises features having an aperture size from 500 nm to 500 μm and the deposition is performed to fill these features.

15. The process according to claim 14 , wherein the aperture size is from 1 μm to 200 μm.

Assignees

• Basf Se

Inventors

• Fluegel Alexander
• Arnold Marco
• Engelhardt Nadine
• Kienle Marcel Patrik

Classifications

• H10W72/232

  Plan-view shape, i.e. in top view · CPC title

• H10W72/01235

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• C25D3/32 Primary

  characterised by the organic bath constituents used · CPC title