Sensor packaging method and sensor package
US-2024222308-A1 · Jul 4, 2024 · US
relative to the surface, e.g. recessed, protruding
relative to the surface, e.g. recessed, protruding · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/342 |
| Official title | {relative to the surface, e.g. recessed, protruding} |
| Display label | relative to the surface, e.g. recessed, protruding |
| Total patents | 417 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 33 |
| 2016 | 24 |
| 2017 | 26 |
| 2018 | 32 |
| 2019 | 27 |
| 2020 | 33 |
| 2021 | 39 |
| 2022 | 49 |
| 2023 | 51 |
| 2024 | 39 |
| 2025 | 57 |
| 2026 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Hermetically sealed mems device and its fabrication
US-2017152136-A1 · Jun 1, 2017 · US
Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas
US-9640510-B2 · May 2, 2017 · US
Semiconductor device and production method for same
US-9530722-B2 · Dec 27, 2016 · US
Vertically integrated wafers with thermal dissipation
US-9508685-B2 · Nov 29, 2016 · US
Semiconductor device including built-in crack-arresting film structure
US-2016322324-A1 · Nov 3, 2016 · US
Semiconductor device and method for manufacturing the same
US-9449937-B2 · Sep 20, 2016 · US
Semiconductor device including a semiconductor element and a fixed member to which the semiconductor element is fixed
US-9437520-B2 · Sep 6, 2016 · US
Stack of integrated-circuit chips and electronic device
US-9401349-B2 · Jul 26, 2016 · US
III-Nitride Transistor with Solderable Front Metal
US-2016211337-A1 · Jul 21, 2016 · US
Methods of manufacturing a semiconductor device
US-2016155862-A1 · Jun 2, 2016 · US
Semiconductor device
US-9355937-B2 · May 31, 2016 · US
Semiconductor device including built-in crack-arresting film structure
US-2016141263-A1 · May 19, 2016 · US
Universal solder joints for 3D packaging
US-9343420-B2 · May 17, 2016 · US
Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same
US-9324686-B2 · Apr 26, 2016 · US
Semiconductor laser device
US-2016111854-A1 · Apr 21, 2016 · US
III-Nitride device with solderable front metal
US-9312375-B2 · Apr 12, 2016 · US
Hermetically sealed wafer packages
US-9287237-B2 · Mar 15, 2016 · US
Method for bonding metallic contact areas with dissolution of a sacrificial layer applied on one of the contact areas in at least one of the contact areas
US-2016071817-A1 · Mar 10, 2016 · US
Bonding pad for thermocompression bonding, process for producing a bonding pad and component
US-9281280-B2 · Mar 8, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/342?
- CPC H10W72/342 is the Cooperative Patent Classification code for “relative to the surface, e.g. recessed, protruding.”
- How many patents are filed under CPC H10W72/342 (relative to the surface, e.g. recessed, protruding)?
- Our database includes 417 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/342 growing?
- Publication counts under this code: 39 in 2024 vs 57 in 2025 (latest complete years).