Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas

Patent metadata

Field	Value
Publication number	US-9640510-B2
Application number	US-201314787397-A
Country	US
Kind code	B2
Filing date	Jul 5, 2013
Priority date	Jul 5, 2013
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

A method for bonding of a first, at least partially metallic contact surface of a first substrate to a second, at least partially metallic contact surface of a second substrate, with the following steps, especially the following progression: application of a sacrificial layer which is at least partially, especially predominantly soluble in the material of at least one of the contact surfaces to at least one of the contact surfaces, bonding of the contact surfaces with at least partial solution of the sacrificial layer in at least one of the contact surfaces.

First claim

Having described the invention, the following is claimed:

1. A method for bonding of a first, at least partially metallic, contact surface of a first substrate to a second, at least partially metallic, contact surface of a second substrate, the first and second contact surfaces being formed as hybrid surfaces, the method comprising:
removing oxides from the first and second contact surfaces,
applying a sacrificial layer to at least one of the first and second contact surfaces, the sacrificial layer being at least predominantly soluble in material of at least one of the first and second contact surfaces, and
bonding the first and second substrates with a solution of the sacrificial layer in the at least one of the first and second contact surfaces,
wherein the sacrificial layer is comprised of water,
wherein the at least one of the first and second contact surfaces is formed of several bond regions of the first and second substrates and bulk material which surrounds the bond regions.

2. The method as claimed in claim 1 , wherein the sacrificial layer is applied with a thickness of less than 1000 nm.

3. The method as claimed in claim 1 , wherein a ratio of a thickness of the sacrificial layer to a thickness of the first and second substrates is less than 1.

4. The method as claimed in claim 1 , wherein at least one of the first and second contact surfaces is located in blanket fashion on one bond region of the first and second substrates.

5. The method as claimed in claim 1 , wherein the sacrificial layer consists completely of water.

6. The method as claimed in claim 1 , wherein the sacrificial layer is applied with a thickness of less than 100 nm.

7. The method as claimed in claim 1 , wherein the sacrificial layer is applied with a thickness of less than 10 nm.

8. The method as claimed in claim 1 , wherein the sacrificial layer is applied with a thickness of less than 1 nm.

9. The method as claimed in claim 1 , wherein a ratio of a thickness of the sacrificial layer to a thickness of the first and second substrates is less than 10 −2 .

10. The method as claimed in claim 1 , wherein a ratio of a thickness of the sacrificial layer to a thickness of the first and second substrates is less than 10 −4 .

11. The method as claimed in claim 1 , wherein a ratio of a thickness of the sacrificial layer to a thickness of the first and second substrates is less than 10 −6 .

12. The method as claimed in claim 1 , wherein a ratio of a thickness of the sacrificial layer to a thickness of the first and second substrates is less than 10 −8 .

13. A method for bonding of a first, at least partially metallic, contact surface of a first substrate to a second, at least partially metallic contact surface of a second substrate, the first and second contact surfaces being formed as hybrid surfaces, the method comprising:
removing oxides from the first and second contact surfaces,
respectively forming a plurality of cavities in at least one of the first and second substrates to define metallic bond regions in at least one of the first contact surface of the first substrate and the second contact surface of the second substrate,
applying a sacrificial layer to the at least one of the first and second contact surfaces, the sacrificial layer being at least predominantly soluble in material of the at least one of the first and second contact surfaces, and
bonding the first and second substrates with a solution of the sacrificial layer in the at least one of the first and second contact surfaces,
wherein the sacrificial layer is comprised of water.

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Rebhan Bernhard

Classifications

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/942

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

• H10W72/01971

  Cleaning, e.g. oxide removal · CPC title