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Semiconductor device including a semiconductor element and a fixed member to which the semiconductor element is fixed
US9437520B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9437520-B2 |
| Application number | US-201314774444-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 13, 2013 |
| Priority date | Mar 13, 2013 |
| Publication date | Sep 6, 2016 |
| Grant date | Sep 6, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor device includes a semiconductor element having a rectangular shape in a plan view, and a fixed member to which the semiconductor element is fixed. The semiconductor element is disposed so that a rectangular face of the semiconductor element is faced toward a surface of the fixed member. A part of the rectangular face of the semiconductor element is fixed to the surface of the fixed member. At least corner parts of the rectangular face of the semiconductor element are not fixed to the surface of the fixed member.
First claim
Opening claim text (preview).
The invention claimed is: 1. A semiconductor device comprising: a semiconductor element having a rectangular shape in a plan view; and a fixed member to which the semiconductor element is fixed, wherein the semiconductor element is disposed so that a rectangular face of the semiconductor element is faced toward a surface of the fixed member, a part of the rectangular face of the semiconductor element is fixed to the surface of the fixed member with a joint material, a dent having a pointed bottom is provided on the surface of the fixed member at a position corresponding to each of the corner parts of the rectangular face of the semiconductor element, and at least corner parts of the rectangular face of the semiconductor element are not fixed to the surface of the fixed member. 2. The semiconductor device according to claim 1 , wherein the pointed bottom of each of the dents is positioned inside the corresponding dent in a plan view of the fixed member. 3. The semiconductor device according to claim 2 , wherein each of the dents has a semi-conical shape, a conical shape, an elliptic conical shape, or a polygonal pyramid shape. 4. The semiconductor device according to claim 2 , wherein each of the dents has a three-sided pyramid shape. 5. The semiconductor device according to claim 4 , wherein each of the dents includes a center-sided face positioned on a center side of the semiconductor element, and an angle formed by the center-sided face of each of the dents and a surface of the fixed member is less than 45 degrees. 6. The semiconductor device according to claim 1 , wherein each of the dents has a semi-conical shape, a conical shape, an elliptic conical shape, or a polygonal pyramid shape. 7. The semiconductor device according to claim 1 , wherein each of the dents has a three-sided pyramid shape. 8. The semiconductor device according to claim 7 , wherein each of the dents includes a center-sided face positioned on a center side of the semiconductor element, and an angle formed by the center-sided face of each of the dents and a surface of the fixed member is less than 45 degrees.
Assignees
Inventors
Classifications
Soldering or alloying · CPC title
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
Shapes of bond pads · CPC title
of die-attach connectors · CPC title
Active alignment, e.g. using optical alignment using marks or sensors · CPC title
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Frequently asked questions
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- What does patent US9437520B2 cover?
- A semiconductor device includes a semiconductor element having a rectangular shape in a plan view, and a fixed member to which the semiconductor element is fixed. The semiconductor element is disposed so that a rectangular face of the semiconductor element is faced toward a surface of the fixed member. A part of the rectangular face of the semiconductor element is fixed to the surface of the fi…
- Who is the assignee on this patent?
- Orimoto Norimune, Imai Makoto, Toyota Motor Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W42/121. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).