Method for Bonding an Electrically Conductive Element to a Bonding Partner
US-2019356098-A1 · Nov 21, 2019 · US
Controlling the environment, e.g. atmosphere composition or temperature
Controlling the environment, e.g. atmosphere composition or temperature · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/07541 |
| Official title | {Controlling the environment, e.g. atmosphere composition or temperature} |
| Display label | Controlling the environment, e.g. atmosphere composition or temperature |
| Total patents | 122 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 14 |
| 2016 | 6 |
| 2017 | 17 |
| 2018 | 18 |
| 2019 | 11 |
| 2020 | 12 |
| 2021 | 8 |
| 2022 | 12 |
| 2023 | 7 |
| 2024 | 6 |
| 2025 | 10 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Bonding wire for semiconductor device
US-10414002-B2 · Sep 17, 2019 · US
Wire bonding methods and systems incorporating metal nanoparticles
US-10283482-B2 · May 7, 2019 · US
Cu alloy core bonding wire with Pd coating for semiconductor device
US-10236272-B2 · Mar 19, 2019 · US
Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
US-10229870-B2 · Mar 12, 2019 · US
Bonding wire for semiconductor devices
US-2018374816-A1 · Dec 27, 2018 · US
Cortical interface for motor signal recording and sensory signal stimulation
US-2018345019-A1 · Dec 6, 2018 · US
Cortical interface for motor signal recording and sensory signal stimulation
US-10137303-B2 · Nov 27, 2018 · US
Bonding wire for semiconductor device
US-10137534-B2 · Nov 27, 2018 · US
Bonding wire for semiconductor device
US-10121758-B2 · Nov 6, 2018 · US
Method for forming ball in bonding wire
US-10121764-B2 · Nov 6, 2018 · US
Bonding wire for semiconductor device
US-10032741-B2 · Jul 24, 2018 · US
Wire bonding methods and systems incorporating metal nanoparticles
US-2018138143-A1 · May 17, 2018 · US
Bonding wire for semiconductor device
US-2018133843-A1 · May 17, 2018 · US
Method of manufacturing semiconductor device
US-9972598-B2 · May 15, 2018 · US
Bonding wire for semiconductor device
US-2018130763-A1 · May 10, 2018 · US
Bonding wire for semiconductor device
US-2018122765-A1 · May 3, 2018 · US
Method for forming ball in bonding wire
US-2018096965-A1 · Apr 5, 2018 · US
Method of manufacturing semiconductor device
US-2018082977-A1 · Mar 22, 2018 · US
Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
US-9905497-B2 · Feb 27, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/07541?
- CPC H10W72/07541 is the Cooperative Patent Classification code for “Controlling the environment, e.g. atmosphere composition or temperature.”
- How many patents are filed under CPC H10W72/07541 (Controlling the environment, e.g. atmosphere composition or temperature)?
- Our database includes 122 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/07541 growing?
- Publication counts under this code: 6 in 2024 vs 10 in 2025 (latest complete years).