Cortical interface for motor signal recording and sensory signal stimulation

Patent metadata

Field	Value
Publication number	US-10137303-B2
Application number	US-201213473470-A
Country	US
Kind code	B2
Filing date	May 16, 2012
Priority date	May 16, 2011
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to the at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that is/are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. The output signals provide control for a motor prosthesis and the inputs signals provide sensory feedback for the motor prosthesis. The invention, or components thereof, is/are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

First claim

What we claim is:

1. An implantation system comprising:
an implantable device comprising:
a hermetic package enclosing an electronic circuit suitable to be implanted within a head,
a flat flexible circuit, including a polymer base layer, conductive traces and a polymer top layer, and including a plurality of electrodes electrically coupled to the electronic circuit suitable to record neural activity, the flexible circuit forming a plurality of flexible fingers with electrodes disposed directly on each of the flexible fingers, each flexible finger including a tip at an opposite end of the flexible circuit from the hermetic package, and a flexible feature, defining a void, at the tip suitable to accept an implantation tool, and
a wireless transceiver electrically coupled to the electronic circuit for sending data derived from the neural activity and receiving sensory data; and

the implantation tool including a plurality of features configured to engage the voids in each of the fingers and press the plurality of fingers into tissue.

2. The implantation system according to claim 1 , where the electronic circuit is adapted to record electrocorticographic signals.

3. The implantation system according to claim 1 , wherein the electronic circuit is adapted to record local field potential signals.

4. The implantation system according to claim 1 , wherein the data controls a motor prosthesis.

5. The implantation system according to claim 1 , wherein the plurality of electrodes are part of a flexible circuit electrode array bonded to the hermetic package.

6. An implantation system comprising:
a flexible circuit electrode array with integrated array cable adapted for neural stimulation comprising:
a polymer base layer forming an array portion and a cable portion, the cable portion adapted to connect to an electronic circuit and the array portion forming a plurality of separate flexible fingers, each flexible finger including a tip at an opposite end of the array from the electronic circuit, and a flexible feature at the tip, forming a void, suitable to accept an implantation tool,
patterned metal traces deposited on said polymer base layer, including electrodes deposited directly on the flexible fingers,
a polymer top layer deposited on said polymer base layer and said polymer top layer defining voids for electrodes,
wherein at least some electrode surfaces are in different planes, and

the implantation tool including a plurality of features configured to engage the voids in each of the fingers and press the plurality of fingers into tissue.

7. The implantation system according to claim 6 , wherein at least some of the fingers are curved.

8. The implantation system according to claim 6 , wherein at least some of the fingers are pointed.

9. The implantation system according to claim 6 , wherein the voids include plated electrodes.

10. The implantation system according to claim 9 , wherein the plated electrodes have a fractal surface.

11. An implantation system comprising:
a neural interface comprising:
a hermetic package enclosing an electronic circuit suitable to be implanted within a head,
a wireless transceiver electrically coupled to the electronic circuit for sending data derived from neural activity and receiving sensory data, and
a flexible electrode array including
a polymer base layer forming an array portion and a cable portion, the cable portion adapted to connect to an electronic circuit and the array portion forming a plurality of separate flexible fingers, each flexible finger including a tip at an opposite end of the array from the hermetic package and a flexible feature at the tip, defining a void, suitable to accept an implantation tool,
patterned metal traces deposited on said polymer base layer, including electrodes deposited directly on the flexible fingers,
a polymer top layer deposited on said polymer base layer and said metal traces defining voids for electrodes; and

the implantation tool including a plurality of features configured to engage the voids in each of the fingers and press the plurality of fingers into tissue.

12. The implantation system according to claim 11 , wherein said electrode array includes more than 50 electrodes.

13. The implantation system according to claim 11 , wherein said electrode array includes more than 75 electrodes.

14. The implantation system according to claim 11 , wherein said electrode array includes more than 100 electrodes.

15. The implantation system according to claim 11 , wherein said electrode array includes more than 200 electrodes.

16. The implantation system according to claim 11 , further comprising a plurality of thin film electrode arrays electrically coupled to the electronics.

17. The implantation system according to claim 11 , wherein the hermetic package is suitable to be attached to tissue.

18. The implantation system according to claim 17 , wherein the tissue is a dura.

19. The implantation system according to claim 17 , wherein the tissue is a cranium.

20. The implantation system according to claim 17 , wherein the tissue is a scalp.

21. An implantation system comprising:
a flexible circuit electrode array with integrated array cable adapted for neural stimulation comprising:
a polymer base layer forming an array portion and a cable portion, the cable portion adapted to connect to an electronic circuit and the array portion forming a plurality of separate flat flexible fingers,
patterned metal traces deposited on said polymer base layer, including electrodes deposited directly on the flexible fingers;
a polymer top layer deposited on said polymer base layer and said polymer top layer defining voids for electrodes;
wherein the fingers include a tip at an opposite end of the array from the electronic circuit and define voids at the tip suitable to accept an implantation tool;

the implantation tool including a plurality of features configured to engage the voids in each of the fingers and press the plurality of fingers into tissue.

22. The implantation system according to claim 21 , wherein at least some of the fingers are curved.

23. The implantation system according to claim 21 , wherein at least some of the fingers are pointed.

24. The implantation system according to claim 21 , wherein the voids include plated electrodes.

25. The implantation system according to claim 21 , wherein the plated electrodes have a fractal surface.

Assignees

• Greenberg Robert J
• Zhou David Daomin
• Mech Brian V
• Talbot Neil Hamilton
• Dai Rongqing
• Castro Richard Agustin
• Mcclure Kelly H
• Second Sight Medical Products Inc

Inventors

• Greenberg Robert J
• Zhou David Daomin
• Mech Brian V
• Talbot Neil Hamilton
• Dai Rongqing
• Castro Richard Agustin
• Mcclure Kelly H

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07541

  Controlling the environment, e.g. atmosphere composition or temperature · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/951

  Materials of bond pads · CPC title