Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Patent metadata

Field	Value
Publication number	US-9905497-B2
Application number	US-201514844427-A
Country	US
Kind code	B2
Filing date	Sep 3, 2015
Priority date	Aug 29, 2008
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of shortcircuit between the semiconductor dies etc due to a remaining portion of the outer frame of the lead frame after the outer frame is cut. By extending the wire-bonding portion etc on the lead frame in a wire-bonding direction and connecting the wire-bonding portion etc to the outer frame of the lead frame through a connection lead etc, the ultrasonic vibration force in the ultrasonic Al wire bonding is prevented from dispersing and the Al wire and the wire-bonding portion etc are firmly bonded. The outer frame is cut after a resin sealing process is completed. Even when a portion of the outer frame remains on the side surface of the resin package, connection between the connection lead etc and other hanging lead etc are prevented by providing a notch etc in the outer frame between the connection lead etc and the hanging lead etc.

First claim

What is claimed is:

1. A semiconductor device, the device comprising:
a lead frame comprising:
an internal region;
two or more leads extending from the internal region;
an outer frame surrounding the internal region, wherein the outer frame comprises a first edge facing the internal region and a second edge facing the internal region;
first and second connection portions connecting the internal region of the lead frame to the outer frame; and
a notch formed in an edge of the outer frame that is closest to the internal region and between the first and second connection portions, wherein the notch is formed in a region of the outer frame that is spaced apart from each region of the outer frame that is connected to the connection portions, wherein the first edge of the outer frame extends from a region of the outer frame connected to the first connection portion to the region of the outer frame where the notch is formed, and wherein the second edge of the outer frame extends from a region of the outer frame connected to the second connection portion to the region of the outer frame where the notch is formed;

a semiconductor die that is die-bonded to the internal region of the lead frame; and
a resin package sealing the semiconductor die and a portion of the lead frame,

wherein the outer frame of the lead frame is exposed from the resin package.

2. The device of claim 1 , wherein the internal region comprises two or more islands.

3. The device of claim 1 , wherein a resin burr is formed in the notch.

4. The device of claim 1 , wherein the semiconductor die is wire-bonded to the lead frame.

5. The device of claim 4 , wherein the lead frame comprises at least one connection portion extending in a first direction so as to connect a portion of the lead frame that is wire-bonded to the outer frame and at least one connection portion extending in a second direction so as to connect the portion of the lead frame that is wire-bonded to the outer frame, wherein the first direction is different than the second direction.

6. The device of claim 5 , wherein the first direction is substantially perpendicular to the second direction.

7. The device of claim 4 , wherein the semiconductor die is wire-bonded to the lead frame by applying ultrasonic energy.

8. The device of claim 1 , wherein two or more semiconductor dies are die-bonded to different portions of the internal region of the lead frame.

9. The device of claim 1 , wherein the first and second connecting portions each connect different islands in the internal region to the outer frame.

10. A method of processing the device of claim 1 , the method comprising cutting the lead frame through at least the notch to remove the outer frame of the lead frame.

11. A semiconductor device, the semiconductor device comprising:
a lead frame comprising:
an internal region;
two or more leads extending from the internal region;
a peripheral region; and
a first connection portion connecting the internal region of the lead frame to a first portion the peripheral region of the lead frame;
a second connection portion connecting the internal region of the lead frame to a second portion the peripheral region of the lead frame; and
an opening in the peripheral region of the lead frame, wherein the opening electrically insulates the first connection portion from the second connection portion;

a semiconductor die that is die-bonded to the internal region of the lead frame; and
a resin package sealing the semiconductor die and a portion of the lead frame,

wherein the peripheral region of the lead frame is exposed from the resin package, wherein the opening is spaced apart from portions of the peripheral region connected to the first connection portion and the second connection portion, wherein a third portion of the peripheral region comprises an edge that faces the resin package, wherein the edge of the third portion of the peripheral region extends from the first portion of the peripheral region to the opening, wherein a fourth portion of the peripheral region comprises an edge that faces the resin package, and wherein the edge of the fourth portion of the peripheral region extends from the second portion of the peripheral region to the opening.

12. The device of claim 11 , wherein the opening in the peripheral region of the lead frame is formed by cutting through a notch in the lead frame.

13. The device of claim 11 , wherein a resin burr is formed in the opening in the lead frame.

14. The device of claim 11 , wherein the semiconductor die is wire-bonded to the lead frame.

15. The device of claim 14 , wherein the lead frame comprises at least one connection portion extending in a first direction so as to connect a portion of the lead frame that is wire-bonded to the outer frame and at least one connection portion extending in a second direction so as to connect the portion of the lead frame that is wire-bonded to the outer frame, wherein the first direction is different than the second direction.

16. The device of claim 14 , wherein the semiconductor die is wire-bonded to the lead frame by applying ultrasonic energy.

17. The device of claim 11 , wherein two or more semiconductor dies are die-bonded to different portions of the internal region of the lead frame.

18. The device of claim 11 , wherein the first connection portion connects to a first island in the internal region to the lead frame and the second connection portion connects to a second island in the internal region of the lead frame.

19. The device of claim 14 , wherein the semiconductor die is wire-bonded to the lead frame by applying ultrasonic energy.

Assignees

• Semiconductor Components Ind Llc

Inventors

• Susaki Takeshi
• Shindo Masahito
• Onda Kazumi

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07553

  changes in shapes · CPC title

• H10W72/07552

  changes in structures or sizes · CPC title