Bonding wire for semiconductor device

Patent metadata

Field	Value
Publication number	US-10414002-B2
Application number	US-201615515508-A
Country	US
Kind code	B2
Filing date	May 19, 2016
Priority date	Jun 15, 2015
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof. Containing an element that provides bonding reliability in a high-temperature environment improves the bonding reliability of the ball bonded part in high temperature. Furthermore, making an orientation proportion of a crystal orientation <100> angled at 15 degrees or less to a wire longitudinal direction among crystal orientations in the wire longitudinal direction 30% or more when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, and making an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire 0.9 to 1.5 μm provides a strength ratio of 1.6 or less.

First claim

The invention claimed is:

1. A bonding wire for a semiconductor device, the bonding wire comprising:
a Cu alloy core material; and
a Pd coating layer formed on a surface of the Cu alloy core material, wherein
when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <100> angled at 15 degrees or less to a wire axis direction has a proportion of 30% or more among crystal orientations in the wire axis direction,

an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 μm or more and 1.5 μm or less, and
the bonding wire contains one or more elements selected from Ga and Ge, and a concentration of the elements selected from Ga and Ge in total is 0.011 to 1.5% by mass relative to a total mass of the bonding wire.

2. The bonding wire for a semiconductor device according to claim 1 , wherein a strength ratio defined by the following Equation (1) is 1.1 or more and 1.6 or less:
Strength ratio=ultimate strength/0.2% offset yield strength.  (1)

3. The bonding wire for a semiconductor device according to claim 1 , wherein a thickness of the Pd coating layer is 0.015 μm or more and 0.150 μm or less.

4. The bonding wire for a semiconductor device according to claim 1 , further comprising an alloy skin layer containing Au and Pd on the Pd coating layer.

5. The bonding wire for a semiconductor device according to claim 4 , wherein a thickness of the alloy skin layer containing Au and Pd is 0.050 μm or less.

6. The bonding wire for a semiconductor device according to claim 1 , wherein
the bonding wire contains at least one element selected from Ni, Zn, Rh, In, Ir and Pt, and
a concentration of the at least one element selected from Ni, Zn, Rh, In, Ir and Pt in total is 0.011% by mass or more and 2% by mass or less relative to the total mass of the bonding wire.

7. The bonding wire for a semiconductor device according to claim 1 , wherein
the bonding wire contains one or more elements selected from As, Te, Sn, Sb, Bi and Se,
a concentration of the elements selected from As, Te, Sn, Sb, Bi and Se in total is 0.1 ppm by mass or more and 100 ppm by mass or less relative to the total mass of the bonding wire, and
Sn≤10 ppm by mass; Sb≤10 ppm by mass; and Bi≤1 ppm by mass.

8. The bonding wire for a semiconductor device according to claim 1 , wherein
the bonding wire further contains at least one element selected from B, P, Mg, Ca and La, and
a concentration of each of the at least one element selected from B, P, Mg, Ca and La is 1 ppm by mass or more and 200 ppm by mass or less relative to the total mass of the bonding wire.

9. The bonding wire for a semiconductor device according to claim 1 , wherein Cu is present at an outermost surface of the bonding wire.

10. The bonding wire for a semiconductor device according to claim 1 , wherein
the Cu alloy core material contains a metallic element of Group 10 of the Periodic Table of Elements in a total amount of 0.1% by mass or more and 3.0% by mass or less, and
a concentration of Cu at an outermost surface of the wire is 1 at % or more.

Assignees

• Nippon Micrometal Corp
• Nippon Steel & Sumikin Mat Co
• Nippon Steel Chemical & Mat Co Ltd

Inventors

• Yamada Takashi
• Oda Daizo
• Haibara Teruo
• Oishi Ryo
• Saito Kazuyuki
• Uno Tomohiro

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H10W72/07541

  Controlling the environment, e.g. atmosphere composition or temperature · CPC title

• H10W72/07532

  Compression bonding, e.g. thermocompression bonding · CPC title