Cortical interface for motor signal recording and sensory signal stimulation

Patent metadata

Field	Value
Publication number	US-2018345019-A1
Application number	US-201816044379-A
Country	US
Kind code	A1
Filing date	Jul 24, 2018
Priority date	May 16, 2011
Publication date	Dec 6, 2018
Grant date	—

Abstract

The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to the at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that is/are attached to the at least one package. The invention, or components thereof, is/are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain. Variations of the embodiments depend on the physical locations of the coil(s), package(s) and array(s) with respect to the head, cranium, dura, and brain. Novel features of the present invention include the small size of the implantable package which houses the controller, the high number of electrodes that are provided for stimulation and/or sensing and stimulation, and the methods for manufacturing such a device. These features have unique applications in neural stimulation to treat or prevent disorders or disease.

First claim

What we claim is:

1 . A neural interface system comprising:
an external portion including a processor, telemetry circuit, and external coil, the external coil sending power to, and sending and receiving data to and from, an implanted portion; the implanted portion including
an internal coil receiving power from, and sending and receiving data to a from the external coil,
a hermetic package,
an electronic circuit within the hermetic package receiving power from the internal coil and sending and receiving data to and from the internal coil,
a differential neural amplifier within the hermetic package,
an analog to digital converter connecting the differential neural amplifier to the electronic circuit,
a driver within the hermetic package connected to the electronic circuit, and
a flexible circuit including at least one stimulating electrode connected to the driver and at least one sensing electrode connected to the differential neural amplifier, the flexible circuit configured to interface with neural tissue of the brain.

2 . The neural interface system according to claim 1 , further comprising a moisture leakage electronic monitor within the hermetic package.

3 . The neural interface system according to claim 1 , further comprising a band pass filter connected between the differential neural amplifier and the electronic circuit.

4 . The neural interface system according to claim 3 , wherein the band pass filter allows frequencies between 75 and 105 hertz.

5 . The neural interface system according to claim 1 , wherein the data includes control commands including at least one command selected from the group of electrode selection for a neural sensing channel, gain selection, sampling control and other safety and diagnostic commands.

6 . The neural interface system according to claim 1 , wherein the data includes stimulation data for a stimulation channel.

7 . The neural interface system according to claim 1 , wherein the analog to digital converter samples at a rate of 480 hertz.

8 . The neural interface system according to claim 1 , wherein the data includes electrode impedance.

Assignees

• Second Sight Medical Products Inc

Inventors

• Greenberg Robert J
• Zhou David Daomin
• Mach Brian V
• Talbot Neil Hamilton
• Dai Rongqing
• Castro Richard Agustin
• Mcclure Kelly H

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07541

  Controlling the environment, e.g. atmosphere composition or temperature · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/951

  Materials of bond pads · CPC title