Bonding wire for semiconductor device

Patent metadata

Field	Value
Publication number	US-10137534-B2
Application number	US-201515107421-A
Country	US
Kind code	B2
Filing date	Jul 22, 2015
Priority date	Jun 15, 2015
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

A bonding wire includes a Cu alloy core material, and a Pd coating layer formed on the Cu alloy core material. The bonding wire contains at least one element selected from Ni, Zn, Rh, In, Ir, and Pt. A concentration of the elements in total relative to the entire wire is 0.03% by mass or more and 2% by mass or less. When measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <100> angled at 15 degrees or less to a wire axis direction has a proportion of 50% or more among crystal orientations in the wire axis direction. An average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 μm or more and 1.3 μm or less.

First claim

The invention claimed is:

1. A bonding wire for a semiconductor device, the bonding wire comprising:
a Cu alloy core material; and
a Pd coating layer formed on a surface of the Cu alloy core material, wherein
the bonding wire contains at least one element selected from Ni, Zn, Rh, Ir, and Pt,
a concentration of the elements in total relative to the entire wire is 0.03% by mass or more and 2% by mass or less, or
the bonding wire contains In, a concentration of In is 0.07% by mass or more and 2% by mass or less relative to the entire wire,
when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <100> angled at 15 degrees or less to the wire axis direction has a proportion of 50% or more among crystal orientations in the wire axis direction, and
an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 μm or more and 1.3 μm or less.

2. The bonding wire for a semiconductor device according to claim 1 , wherein a strength ratio defined by the following Equation (1) is 1.1 or more and 1.6 or less:
strength ratio=ultimate strength/0.2% offset yield strength  (1).

3. The bonding wire for a semiconductor device according to claim 1 , wherein a thickness of the Pd coating layer is 0.015 μm or more and 0.150 μm or less.

4. The bonding wire for a semiconductor device according to claim 1 , further comprising an alloy skin layer containing Au and Pd on the Pd coating layer.

5. The bonding wire for a semiconductor device according to claim 4 , wherein a thickness of the alloy skin layer containing Au and Pd is 0.0005 μm or more and 0.050 μm or less.

6. The bonding wire for a semiconductor device according to claim 1 , wherein
the bonding wire contains at least one element selected from Ga, Ge, As, Te, Sn, Sb, Bi, and Se,
a concentration of the at least one element in total relative to the entire wire is 0.1 ppm by mass or more and 100 ppm by mass or less, and
Sn≤10 ppm by mass; Sb≤10 ppm by mass; and Bi≤1 ppm by mass.

7. The bonding wire for a semiconductor device according to claim 1 , wherein
the bonding wire further contains at least one element selected from B, P, Mg, Ca, and La, and
a concentration of each of the at least one element relative to the entire wire is 1 ppm by mass or more and 100 ppm by mass or less.

8. The bonding wire for a semiconductor device according to- claim 1 , wherein Cu is present on an outermost surface of the bonding wire.

Assignees

• Nippon Micrometal Corp
• Nippon Steel & Sumikin Mat Co

Inventors

• Yamada Takashi
• Oda Daizo
• Haibara Teruo
• Oishi Ryo
• Saito Kazuyuki
• Uno Tomohiro

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H10W72/07541

  Controlling the environment, e.g. atmosphere composition or temperature · CPC title

• H10W72/07532

  Compression bonding, e.g. thermocompression bonding · CPC title