Wetting pretreatment for enhanced damascene metal filling
US-9852913-B2 · Dec 26, 2017 · US
by treatments not introducing additional elements therein
by treatments not introducing additional elements therein · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W20/052 |
| Official title | {by treatments not introducing additional elements therein} |
| Display label | by treatments not introducing additional elements therein |
| Total patents | 226 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 23 |
| 2017 | 28 |
| 2018 | 25 |
| 2019 | 17 |
| 2020 | 27 |
| 2021 | 6 |
| 2022 | 21 |
| 2023 | 26 |
| 2024 | 15 |
| 2025 | 15 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of forming an interconnection
US-9842767-B2 · Dec 12, 2017 · US
Semiconductor structure and methods of forming the same
US-2017330829-A1 · Nov 16, 2017 · US
Method for manufacturing a semiconductor device
US-2017316973-A1 · Nov 2, 2017 · US
Method and apparatus for single chamber treatment
US-2017301584-A1 · Oct 19, 2017 · US
Tungsten film forming method and storage medium
US-2017283942-A1 · Oct 5, 2017 · US
Semiconductor device and method of manufacturing the same
US-9761531-B2 · Sep 12, 2017 · US
Semiconductor devices and methods of manufacturing the same
US-9754826-B2 · Sep 5, 2017 · US
Method for Via Plating with Seed Layer
US-2017236750-A1 · Aug 17, 2017 · US
Semiconductor structure and fabrication method thereof
US-9718682-B2 · Aug 1, 2017 · US
Oxidation resistant barrier metal process for semiconductor devices
US-9704804-B1 · Jul 11, 2017 · US
Method and apparatus for single chamber treatment
US-9702042-B1 · Jul 11, 2017 · US
Conformal Amorphous Silicon As Nucleation Layer For W ALD Process
US-2017179036-A1 · Jun 22, 2017 · US
Oxidation resistant barrier metal process for semiconductor devices
US-2017179033-A1 · Jun 22, 2017 · US
Semiconductor device manufacturing method and semiconductor device
US-2017154777-A1 · Jun 1, 2017 · US
Method for via plating with seed layer
US-9640431-B2 · May 2, 2017 · US
Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
US-9617648-B2 · Apr 11, 2017 · US
Semiconductor structure and fabrication method thereof
US-2017029272-A1 · Feb 2, 2017 · US
Method and apparatus for single chamber treatment
US-9536780-B1 · Jan 3, 2017 · US
Copper filling-up method
US-9512534-B2 · Dec 6, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W20/052?
- CPC H10W20/052 is the Cooperative Patent Classification code for “by treatments not introducing additional elements therein.”
- How many patents are filed under CPC H10W20/052 (by treatments not introducing additional elements therein)?
- Our database includes 226 publications tagged with this CPC code.
- Is patent activity under CPC H10W20/052 growing?
- Publication counts under this code: 15 in 2024 vs 15 in 2025 (latest complete years).