Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge
US-12588463-B2 · Mar 24, 2026 · US
characterised by a material, a roughness, a coating or the like
characterised by a material, a roughness, a coating or the like · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/155 |
| Official title | {characterised by a material, a roughness, a coating or the like} |
| Display label | characterised by a material, a roughness, a coating or the like |
| Total patents | 25 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 1 |
| 2019 | 1 |
| 2020 | 2 |
| 2021 | 5 |
| 2022 | 3 |
| 2023 | 3 |
| 2024 | 6 |
| 2025 | 1 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Apparatus for transporting semiconductor wafers
US-12308267-B2 · May 20, 2025 · US
Semiconductor Device and Methods of Making and Using an Enhanced Carrier to Reduce Electrostatic Discharge
US-2024355655-A1 · Oct 24, 2024 · US
Wet bench structure
US-12074041-B2 · Aug 27, 2024 · US
Electrostatic chuck heater and manufacturing method therefor
US-12040209-B2 · Jul 16, 2024 · US
Apparatus for transporting semiconductor wafers
US-2024178026-A1 · May 30, 2024 · US
Wet bench structure
US-11961745-B2 · Apr 16, 2024 · US
Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
US-11929272-B2 · Mar 12, 2024 · US
Under boat support with electrostatic discharge structure
US-2023386875-A1 · Nov 30, 2023 · US
Substrate processing apparatus, quartz reaction tube and method of manufacturing semiconductor device
US-11685992-B2 · Jun 27, 2023 · US
Systems and methods for tray cassette warehousing
US-2023095609-A1 · Mar 30, 2023 · US
Systems and methods for tray cassette warehousing
US-11527425-B2 · Dec 13, 2022 · US
Wet bench structure
US-2022351986-A1 · Nov 3, 2022 · US
Manufacturing method of ESD protection device
US-11328946-B2 · May 10, 2022 · US
Manufacturing method of esd protection device
US-2021282253-A1 · Sep 9, 2021 · US
Electrostatic chuck heater and manufacturing method therefor
US-2021242062-A1 · Aug 5, 2021 · US
Systems and methods for tray cassette warehousing
US-2021202277-A1 · Jul 1, 2021 · US
ESD protection composite structure, ESD protection device, and manufacturing method thereof
US-11044798-B2 · Jun 22, 2021 · US
Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
US-2021035835-A1 · Feb 4, 2021 · US
Substrate processing apparatus, quartz reaction tube and method of manufacturing semiconductor device
US-2020149159-A1 · May 14, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/155?
- CPC H10P72/155 is the Cooperative Patent Classification code for “characterised by a material, a roughness, a coating or the like.”
- How many patents are filed under CPC H10P72/155 (characterised by a material, a roughness, a coating or the like)?
- Our database includes 25 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/155 growing?
- Publication counts under this code: 6 in 2024 vs 1 in 2025 (latest complete years).