Electrostatic chuck heater and manufacturing method therefor

US12040209B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12040209-B2
Application numberUS-201916770006-A
CountryUS
Kind codeB2
Filing dateJan 24, 2019
Priority dateFeb 28, 2018
Publication dateJul 16, 2024
Grant dateJul 16, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The present invention relates to an electrostatic chuck heater and a manufacturing method therefor and, more particularly, to an electrostatic chuck heater comprising: a ground electrode; and an electrostatic chuck electrode spaced a predetermined distance apart from the outside of the ground electrode, wherein the heater can reduce the phenomenon of rising of a wafer edge and thus can significantly reduce the temperature deviation according to positions on a heating surface of an object, such as a wafer, so as to increase the temperature uniformity of the heating surface.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electrostatic chuck heater comprising: a ceramic plate including a ground electrode; and an electrostatic chuck electrode spaced a predetermined distance apart from an outer side of the ground electrode, wherein an electrostatic chuck electrode connecting member is connected to the electrostatic chuck electrode, and is embedded in the ceramic plate, wherein the electrostatic chuck electrode connecting member is positioned on a first plane that is different from and parallel to a second plane on which the electrostatic chuck electrode is positioned. 2. The electrostatic chuck heater of claim 1 , wherein the ground electrode and the electrostatic chuck electrode are provided on the same plane. 3. The electrostatic chuck heater of claim 1 , wherein the electrostatic chuck electrode is any one of a sheet type and a mesh type. 4. The electrostatic chuck heater of claim 1 , wherein the ground electrode has a circular plate shape having a diameter of 285 mm, and the electrostatic chuck electrode has a ring shape having an inner diameter of 290 mm and an outer diameter of 320 mm. 5. The electrostatic chuck heater of claim 1 , wherein the electrostatic chuck electrode has a thickness of 0.2 mm. 6. The electrostatic chuck heater of claim 1 , further comprising: the electrostatic chuck connecting member for supplying electric power to the electrostatic chuck electrode, wherein a material of the electrostatic chuck connecting member is molybdenum (Mo). 7. The electrostatic chuck heater of claim 6 , wherein the electrostatic chuck connecting member is any one of a sheet type and a mesh type. 8. The electrostatic chuck heater of claim 1 , wherein the electrostatic chuck connecting member is connected to an electrostatic chuck rod positioned at a center region of the electrostatic chuck heater. 9. A method of manufacturing an electrostatic chuck heater, the method comprising: forming a ceramic powder layer structure in which a ceramic molded body, in which a ground electrode and an electrostatic chuck electrode are embedded, is interposed between a first ceramic powder layer and a second ceramic powder layer; and sintering the ceramic powder layer structure, wherein the electrostatic chuck electrode is spaced a predetermined distance apart from an outer side of the ground electrode. 10. The method of claim 9 , wherein the ceramic powder layer structure further comprises a heating element between the second ceramic powder layer and a third ceramic powder layer. 11. The method of claim 9 , wherein the forming of the ceramic molded body comprises: processing a molded body; providing an electrostatic chuck connecting member; providing a ground rod connecting member and an electrostatic chuck rod connecting member; and providing the ground electrode and the electrostatic chuck electrode. 12. The method of claim 11 , wherein the ground electrode and the electrostatic chuck electrode are provided on the same plane. 13. The method of claim 11 , wherein the electrostatic chuck electrode is any one of a sheet type and a mesh type. 14. The method of claim 11 , wherein the ground electrode has a circular plate shape having a diameter of 285 mm, and the electrostatic chuck electrode has a ring shape having an inner diameter of 290 mm and an outer diameter of 320 mm. 15. The method of claim 11 , wherein the electrostatic chuck electrode has a thickness of 0.2 mm. 16. The method of claim 11 , wherein a material of the electrostatic chuck connecting member is molybdenum (Mo). 17. The method of claim 11 , wherein the electrostatic chuck connecting member is any one of a sheet type and a mesh type. 18. The method of claim 9 , wherein the forming further comprises positioning an electrostatic chuck connecting member in a different plane from that where the electrostatic chuck electrode is embedded, and connecting the electrostatic chuck connecting member to the electrostatic chuck electrode. 19. An electrostatic chuck heater comprising: a ground electrode; an electrostatic chuck electrode spaced a predetermined distance apart from an outer side of the ground electrode; and an electrostatic chuck connecting member for supplying electric power to the electrostatic chuck electrode, wherein a material of the electrostatic chuck connecting member is molybdenum (Mo).

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What does patent US12040209B2 cover?
The present invention relates to an electrostatic chuck heater and a manufacturing method therefor and, more particularly, to an electrostatic chuck heater comprising: a ground electrode; and an electrostatic chuck electrode spaced a predetermined distance apart from the outside of the ground electrode, wherein the heater can reduce the phenomenon of rising of a wafer edge and thus can signific…
Who is the assignee on this patent?
Mico Ceram Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0432. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).