Electrostatic chuck, substrate processing apparatus, and method of manufacturing semiconductor device using the same
US-10522374-B2 · Dec 31, 2019 · US
US12040209B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12040209-B2 |
| Application number | US-201916770006-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 24, 2019 |
| Priority date | Feb 28, 2018 |
| Publication date | Jul 16, 2024 |
| Grant date | Jul 16, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present invention relates to an electrostatic chuck heater and a manufacturing method therefor and, more particularly, to an electrostatic chuck heater comprising: a ground electrode; and an electrostatic chuck electrode spaced a predetermined distance apart from the outside of the ground electrode, wherein the heater can reduce the phenomenon of rising of a wafer edge and thus can significantly reduce the temperature deviation according to positions on a heating surface of an object, such as a wafer, so as to increase the temperature uniformity of the heating surface.
Opening claim text (preview).
The invention claimed is: 1. An electrostatic chuck heater comprising: a ceramic plate including a ground electrode; and an electrostatic chuck electrode spaced a predetermined distance apart from an outer side of the ground electrode, wherein an electrostatic chuck electrode connecting member is connected to the electrostatic chuck electrode, and is embedded in the ceramic plate, wherein the electrostatic chuck electrode connecting member is positioned on a first plane that is different from and parallel to a second plane on which the electrostatic chuck electrode is positioned. 2. The electrostatic chuck heater of claim 1 , wherein the ground electrode and the electrostatic chuck electrode are provided on the same plane. 3. The electrostatic chuck heater of claim 1 , wherein the electrostatic chuck electrode is any one of a sheet type and a mesh type. 4. The electrostatic chuck heater of claim 1 , wherein the ground electrode has a circular plate shape having a diameter of 285 mm, and the electrostatic chuck electrode has a ring shape having an inner diameter of 290 mm and an outer diameter of 320 mm. 5. The electrostatic chuck heater of claim 1 , wherein the electrostatic chuck electrode has a thickness of 0.2 mm. 6. The electrostatic chuck heater of claim 1 , further comprising: the electrostatic chuck connecting member for supplying electric power to the electrostatic chuck electrode, wherein a material of the electrostatic chuck connecting member is molybdenum (Mo). 7. The electrostatic chuck heater of claim 6 , wherein the electrostatic chuck connecting member is any one of a sheet type and a mesh type. 8. The electrostatic chuck heater of claim 1 , wherein the electrostatic chuck connecting member is connected to an electrostatic chuck rod positioned at a center region of the electrostatic chuck heater. 9. A method of manufacturing an electrostatic chuck heater, the method comprising: forming a ceramic powder layer structure in which a ceramic molded body, in which a ground electrode and an electrostatic chuck electrode are embedded, is interposed between a first ceramic powder layer and a second ceramic powder layer; and sintering the ceramic powder layer structure, wherein the electrostatic chuck electrode is spaced a predetermined distance apart from an outer side of the ground electrode. 10. The method of claim 9 , wherein the ceramic powder layer structure further comprises a heating element between the second ceramic powder layer and a third ceramic powder layer. 11. The method of claim 9 , wherein the forming of the ceramic molded body comprises: processing a molded body; providing an electrostatic chuck connecting member; providing a ground rod connecting member and an electrostatic chuck rod connecting member; and providing the ground electrode and the electrostatic chuck electrode. 12. The method of claim 11 , wherein the ground electrode and the electrostatic chuck electrode are provided on the same plane. 13. The method of claim 11 , wherein the electrostatic chuck electrode is any one of a sheet type and a mesh type. 14. The method of claim 11 , wherein the ground electrode has a circular plate shape having a diameter of 285 mm, and the electrostatic chuck electrode has a ring shape having an inner diameter of 290 mm and an outer diameter of 320 mm. 15. The method of claim 11 , wherein the electrostatic chuck electrode has a thickness of 0.2 mm. 16. The method of claim 11 , wherein a material of the electrostatic chuck connecting member is molybdenum (Mo). 17. The method of claim 11 , wherein the electrostatic chuck connecting member is any one of a sheet type and a mesh type. 18. The method of claim 9 , wherein the forming further comprises positioning an electrostatic chuck connecting member in a different plane from that where the electrostatic chuck electrode is embedded, and connecting the electrostatic chuck connecting member to the electrostatic chuck electrode. 19. An electrostatic chuck heater comprising: a ground electrode; an electrostatic chuck electrode spaced a predetermined distance apart from an outer side of the ground electrode; and an electrostatic chuck connecting member for supplying electric power to the electrostatic chuck electrode, wherein a material of the electrostatic chuck connecting member is molybdenum (Mo).
mainly by conduction · CPC title
Details of electrostatic chucks · CPC title
characterised by a material, a roughness, a coating or the like · CPC title
uniformity · CPC title
Temperature · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.