Controlled Buckling Structures in Semiconductor Interconnects and Nanomembranes for Stretchable Electronics
US-2016381789-A1 · Dec 29, 2016 · US
by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)}
by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)} · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/20 |
| Official title | by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)} |
| Display label | by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)} |
| Total patents | 316 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 28 |
| 2016 | 41 |
| 2017 | 38 |
| 2018 | 32 |
| 2019 | 28 |
| 2020 | 26 |
| 2021 | 24 |
| 2022 | 28 |
| 2023 | 20 |
| 2024 | 26 |
| 2025 | 21 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
US-2016381805-A1 · Dec 29, 2016 · US
Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
US-2016381806-A1 · Dec 29, 2016 · US
Printed circuit board and manufacturing method thereof
US-9532462-B2 · Dec 27, 2016 · US
Electronic part embedded substrate and method of producing an electronic part embedded substrate
US-2016358858-A1 · Dec 8, 2016 · US
Coreless packaging substrate and fabrication method thereof
US-9510463-B2 · Nov 29, 2016 · US
Substrate structures and methods of manufacture
US-2016323997-A1 · Nov 3, 2016 · US
Depositing bulk or micro-scale electrodes
US-9485873-B2 · Nov 1, 2016 · US
RF printed circuit board including vertical integration and increased layout density
US-9485869-B2 · Nov 1, 2016 · US
Housing for electronic circuit unit
US-9480153-B2 · Oct 25, 2016 · US
Method of manufacturing a circuit board by punching
US-9478674-B2 · Oct 25, 2016 · US
Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces
US-2016309584-A1 · Oct 20, 2016 · US
Electronic textile with means for facilitating waste sorting
US-9474151-B2 · Oct 18, 2016 · US
Copper foil for printed circuit
US-2016286665-A1 · Sep 29, 2016 · US
Waveguide coupler
US-2016276731-A1 · Sep 22, 2016 · US
Fluororesin base material, printed wiring board, and circuit module
US-2016250830-A1 · Sep 1, 2016 · US
Substrate structures and methods of manufacture
US-9408301-B2 · Aug 2, 2016 · US
Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces
US-9398705-B2 · Jul 19, 2016 · US
Dielectric Pastes For Aluminum Substrates
US-2016185651-A1 · Jun 30, 2016 · US
Method of manufacturing wiring substrate
US-9380707-B2 · Jun 28, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/20?
- CPC H05K3/20 is the Cooperative Patent Classification code for “by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)}.”
- How many patents are filed under CPC H05K3/20 (by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)})?
- Our database includes 316 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/20 growing?
- Publication counts under this code: 26 in 2024 vs 21 in 2025 (latest complete years).