Electronic textile with means for facilitating waste sorting

Patent metadata

Field	Value
Publication number	US-9474151-B2
Application number	US-201214362730-A
Country	US
Kind code	B2
Filing date	Nov 27, 2012
Priority date	Dec 7, 2011
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

According to the present invention, an electronic textile ( 1 ) is provided. The electronic textile comprises an electronic structure ( 3 ) including conductive wires ( 4 ) being at least partly spaced apart from each other and one or more electronic components ( 5 ) connected to the conductive wires. One or more gaps ( 14 ) are formed in the electronic structure between the at least partly spaced apart conductive wires. The electronic textile further comprises a fabric structure ( 2 ) including two fabric portions ( 10 ), wherein the electronic structure is sandwiched between the two fabric portions. Further, the two fabric portions are joined together according to a bonding pattern including bonding segments ( 8 ), the bonding segments being arranged in one or more of the gaps of the electronic structure such that the electronic structure is held in place in the fabric structure by the bonding pattern. With the present invention, the separation of the electronics from the fabric is made easier, which is advantageous in that waste sorting of the electronic textile is facilitated.

First claim

The invention claimed is:

1. An electronic textile comprising:
an electronic structure including conductive wires being at least partly spaced apart from each other and one or more electronic components connected to the conductive wires, wherein one or more gaps are formed in the electronic structure between the at least partly spaced apart conductive wires, and
a fabric structure including two fabric portions,
wherein the electronic structure is between the two fabric portions, and
wherein the two fabric portions are joined together according to a bonding pattern including bonding segments, the bonding segments being arranged in one or more of the gaps of the electronic structure such that the electronic structure is held in place in the fabric structure by the bonding pattern, wherein a bonding strength of the bonding segments is weaker than a tear strength of the fabric portions.

2. An electronic textile as defined in claim 1 , wherein the fabric portions are joined together by welding.

3. An electronic textile as defined in claim 1 , wherein the conductive wires and the electronic components are arranged in the fabric structure in one or more recesses formed by the two fabric portions between the bonding segments.

4. An electronic textile as defined in claim 1 , wherein the conductive wires and/or the electronic components are detached from the fabric portions.

5. An electronic textile as defined in claim 1 , wherein the bonding segments electrically insulate the conductive wires and/or the electronic components from neighboring conductive wires and/or electronic components.

6. An electronic textile as defined in claim 1 , wherein the bonding pattern further includes a bonding segment outside the periphery of the electronic structure.

7. An electronic textile as defined in claim 6 , wherein a bonding strength of the bonding segment outside the periphery of the electronic structure is stronger than a bonding strength of the bonding segments arranged in the gaps of the electronic structure.

8. An electronic textile as defined in claim 6 , wherein a bonding strength of the bonding segment outside the periphery of the electronic structure is stronger than a tear strength of the fabric portions.

9. An electronic textile as defined in claim 1 , wherein the electronic structure includes one or more spaced apart pairs of conductive wires, wherein the conductive wires within each pair are at least partly spaced apart from each other, wherein each one of the electronic components is connected to one of the pairs of conductive wires, and wherein the bonding segments are arranged in gaps of the electronic structure formed between the at least partly spaced apart conductive wires within each pair and in gaps of the electronic structure formed between the pairs of conductive wires.

10. An electronic textile as defined in claim 1 , wherein the electronic structure comprises a counter component configured to store the number of re-uses of the electronic structure.

11. An electronic textile as defined in claim 1 , wherein the conductive wires are bare wires.

12. A method of manufacturing an electronic textile, the method comprising the steps of:
providing an electronic structure including conductive wires being at least partly spaced apart from each other and one or more electronic components connected to the conductive wires, wherein one or more gaps are formed in the electronic structure between the at least partly spaced apart conductive wires,
providing a fabric structure including two fabric portions,
sandwiching the electronic structure between the two fabric portions, and
joining the two fabric portions together according to a bonding pattern including bonding segments, such that the bonding segments are arranged in one or more of the gaps of the electronic structure, whereby the electronic structure is held in place in the fabric structure by the bonding pattern, and wherein a bonding strength of the bonding segments is weaker than a tear strength of the fabric portions.

13. A method as defined in claim 12 , wherein the step of joining the fabric portions together is made by welding.

14. A method as defined in claim 12 , further comprising the steps of arranging the conductive wires in a frame, and cutting the conductive wires out of the frame subsequent to the step of joining the fabric portions together.

Assignees

• Koninklijke Philips Nv

Inventors

• Van Os Jacobus Petrus Johannes
• Luitjens Steven Broeils
• Van Pieterson Liesbeth
• Zhou Guofu
• Van Abeelen Frank Anton

Classifications

• H05K3/20

  by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)} · CPC title

• H05K1/038 Primary

  Textiles (used as reinforcing materials for organic insulating substrates H05K1/0366) · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title