RF printed circuit board including vertical integration and increased layout density

Patent metadata

Field	Value
Publication number	US-9485869-B2
Application number	US-201414516018-A
Country	US
Kind code	B2
Filing date	Oct 16, 2014
Priority date	Aug 23, 2013
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

A printed circuit board includes a plurality of sub-circuits that form at least one circuit channel. The printed circuit board further includes a first surface, a second surface opposite the first surface, and at least one layer interposed between the first and second surfaces. A plurality of surface portions are formed on the first surface. The printed circuit board further includes at least one embedded sub-circuit of the at least one circuit channel. The embedded sub-circuit is embedded in the at least one layer and is electromagnetically isolated from the plurality of surface portions.

First claim

What is claimed is:

1. A printed circuit board having a plurality of circuit channels formed thereon, the printed circuit board comprising:
a body extending along a first direction to define a length, and a second direction perpendicular to the first direction to define a width, the body including:
at least one layer extending in a third direction perpendicular to the first direction and the second direction, the at least one layer interposed between a first surface and an opposing second surface, wherein the at least one layer includes a first layer portion and a second layer portion; and
a plurality of surface portions formed on at least one of the first surface and the second surface, the plurality of surface portions including a first surface portion having a first surface sub-circuit formed thereon, and a second surface portion having a second surface sub-circuit formed thereon, the first and second surface portions formed from an electrically conductive material;

the printed circuit board including at least one surface sub-circuit of a first circuit channel among the plurality of circuit channels, the at least one surface sub-circuit formed on at least one of the first and second surfaces; and
at least one embedded sub-circuit of the first circuit channel, the embedded sub-circuit being different from the at least one surface sub-circuit and being embedded in the at least one layer,
wherein the at least one embedded sub-circuit includes a first strip-line filter embedded in the first layer portion and a second strip-line filter embedded in the second layer portion, the first and second strip-line filters being electrically isolated from the first and second surface portions.

2. The printed circuit board of claim 1 , wherein the first layer portion is electromagnetically isolated from the second layer portion.

3. The printed circuit board of claim 2 , wherein the second surface portion is electrically isolated from the first surface portion.

4. The printed circuit board of claim 1 , wherein the first embedded sub-circuit includes an input and an output, the input being in electrical communication with the first surface sub-circuit and the output being in electrical communication with the second surface sub-circuit.

5. The printed circuit board of claim 4 , wherein the first surface includes a third surface portion having a third surface sub-circuit formed thereon, the third surface sub-circuit being electrically isolated from the first and second surface portions, and wherein the at least one layer includes a second layer having a third layer portion, the third layer portion including a third embedded sub-circuit different from the first and second embedded sub-circuits.

6. The printed circuit board of claim 5 , wherein the third embedded sub-circuit includes an input in electrical communication with the second surface sub-circuit, and an output in electrical communication with the second embedded sub-circuit.

7. The printed circuit board of claim 6 , wherein the second embedded sub-circuit includes an output in electrical communication with the third surface sub-circuit, the third surface sub-circuit including a main output of the first circuit channel.

8. The printed circuit board of claim 7 , wherein a first electrically conductive via extends through the at least one layer and connects the input of the first embedded sub-circuit with an output of the first surface sub-circuit, a second electrically conductive via extends through the at least one layer and connects the output of the first embedded sub-circuit with an input of the second surface sub-circuit, a third electrically conductive via extends through the at least one layer and connects an output of the second surface sub-circuit with the input of the third embedded sub-circuit, a fourth electrically conductive via extends through the at least one layer and connects the output of the third embedded sub-circuit with the input of the second embedded sub-circuit, and a fifth electrically conductive via extends through the at least one layer and connects the output of the second embedded sub-circuit with an input of the third surface sub-circuit.

9. The printed circuit board of claim 1 , wherein the first and second surface sub-circuits include surface mounted electronic components, the surface-mounted electronic components including at least one of a resistor, capacitor and an amplifier.

10. A printed circuit board including a plurality of sub-circuits that form at least one circuit channel, the printed circuit board comprising:
a first surface, a second surface opposite the first surface, and at least one layer interposed between the first and second surfaces, the at least one layer electromagnetically isolated from the first and second surfaces;
a plurality of surface portions formed on the first surface; and
at least one embedded sub-circuit of the at least one circuit channel, the at least one embedded sub-circuit being embedded in the at least one layer and being electromagnetically isolated from the plurality of surface portions,
wherein the plurality of surface portions are formed from an electrically conductive material, and the at least one embedded sub-circuit is a strip-line filter.

11. The printed circuit board of claim 10 , wherein the plurality of surface portions are formed from copper.

12. The printed circuit board of claim 11 , wherein the at least one layer includes a first electrical insulator interposed between the first surface and the strip-line filter and a second electrical insulator interposed between the second surface and the strip-line filter, the first and second electrical insulators electromagnetically insulating the strip-line filter from the plurality of surface portions.

13. The printed circuit board of claim 12 , wherein the strip-line filter is configured to filter a radio-frequency (RF) signal, and wherein the plurality of surface sub-circuits includes at least one of a resistor, a capacitor and an amplifier.

14. The printed circuit board of claim 13 , wherein the at least one embedded sub-circuit includes a first embedded sub-circuit and a second embedded sub-circuit, the first and second embedded sub-circuits being electromagnetically isolated from one another.

15. A method of fabricating a printed circuit board, the method comprising:
forming at least one layer between first and second opposing surfaces of the printed circuit board;
forming a plurality of surface portions on at least one of the first and second surfaces;
embedding at least one embedded sub-circuit of the at least one circuit channel in the at least one layer; and
electromagnetically isolating the least one layer from the first and second surfaces such that the embedded sub-circuit is electromagnetically isolated from the plurality of surface portions,
wherein the plurality of surface portions are formed from an electrically conductive material, and the at least one embedded sub-circuit is a strip-line filter.

16. The method of claim 15 , wherein the plurality of surface portions are formed from copper.

17. The method of claim 15 , wherein the at least one layer includes a first electrical insulator interposed between the first surface and the strip-line filter and a second electrical insulator interposed between the second surface and the strip-line filter, the first and second electrical insulators electromagnetically insulating the strip-line filter from the plurality of surface portions.

18. The method of claim 17 , wherein the strip-line filter is configured to filter a radio-frequ

Assignees

• Raytheon Co

Inventors

• Schuster Gary P

Classifications

• H05K1/16

  incorporating printed electric components, e.g. printed resistors, capacitors or inductors · CPC title

• H05K3/4694

  Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density (H05K3/4691 takes precedence) · CPC title

• H05K1/0237 Primary

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title

• Y10T29/49128

  Assembling formed circuit to base · CPC title

• H05K1/0218

  by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence) · CPC title