Method of forming conductive traces on insulated substrate

Patent metadata

Field	Value
Publication number	US-9504165-B2
Application number	US-201414161122-A
Country	US
Kind code	B2
Filing date	Jan 22, 2014
Priority date	Dec 20, 2013
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A method of forming conductive traces on insulated substrate includes the steps of providing an insulated substrate; forming a coating layer on a surface of the insulated substrate, dividing the coating layer into traces-forming zones and non-traces-forming zones through laser engraving, and removing areas of the coating layer that are located in the traces-forming zones through laser-vaporizing to expose corresponding portions of the surface of the insulated substrate; forming a metallized layer of conductive traces by performing a metallizing treatment on the exposed portions of the insulated substrate and on the coating layer; and directly stripping off the residual coating layer from the non-traces-forming zones or removing it using an acid, an alkaline or a neutral solution.

First claim

What is claimed is:

1. A method of forming conductive traces on insulated substrate, comprising the following steps:
(1) providing an insulated substrate;
(2) forming a coating layer on a surface of the insulated substrate through a process selected from the group consisting of spray coating, pad printing, screen printing, roller coating and impregnating;
(3) using a laser beam to laser engrave the coating layer, so that the coating layer is divided into traces-forming zones and non-traces-forming zones;
meanwhile, using the laser beam to laser-vaporize and accordingly remove areas of the coating layer in the traces-forming zones to expose portions of the surface of the underlying insulated substrate that are corresponding to the laser-vaporized areas of the coating layer;
(4) forming a metallized layer of conductive traces by performing a metallizing treatment on the exposed portions of the surface of the insulated substrate and on the coating layer; and
(5) removing any part of the coating layer and of the metallized layer of conductive traces that are located in the non-traces-forming zones by directly stripping them off or through an action of an acid solution, an alkaline solution or a neutral solution, so that the metallized layer of conductive traces is left only on the portions of the surface of the insulated substrate that are corresponding to the traces-forming zones.

2. The method of forming conductive traces on insulated substrate as claimed in claim 1 , further comprising the following step after the step (5):
(6) forming a metal protection layer on the metallized layer of conductive trace through a process selected from the group consisting of electroplating and chemical deposition; wherein the metal protection layer so formed is one single metal layer selected from the group consisting of a chemical silver plating, a chemical zirconium plating, a tin plating and a tin alloy plating, or includes a chemical gold plating deposited on a top of a chemical nickel plating.

3. The method of forming conductive traces on insulated substrate as claimed in claim 1 , wherein the insulated substrate is made of a material selected from the group consisting of a ceramic material and a glass material; and the ceramic material being selected from the group consisting of aluminum oxide, aluminum nitride and silicon carbide.

4. The method of forming conductive traces on insulated substrate as claimed in claim 1 , wherein the insulated substrate is made of a material selected from the group consisting of a synthetic resin material and a composite material; the synthetic material being selected from the group consisting of polycarbonate (PC), polycarbonate/acrylonitrile butadiene styrene (PC/ABS), nylon and acrylic; and the composite material being made by combining fiberglass with one type of synthetic resin selected from the group consisting of PC, PC/ABS and nylon.

5. The method of forming conductive traces on insulated substrate as claimed in claim 1 , wherein the insulated substrate can be a two-dimensional structure or a three-dimensional structure.

6. The method of forming conductive traces on insulated substrate as claimed in claim 1 , wherein the laser beam used in step (3) has a wavelength between 355 and 1064 nanometers (nm).

7. The method of forming conductive traces on insulated substrate as claimed in claim 1 , wherein, during the laser-vaporizing process in step (3), the portions of the surface of the insulated substrate that are corresponding to the laser-vaporized areas of the coating layer are also coarsened by the laser beam through laser engraving to form a plurality of pits of different depths for increasing an adhesion between the insulated substrate and the metallized layer of conductive traces formed through the metallizing treatment in the subsequent step (4).

8. The method of forming conductive traces on insulated substrate as claimed in claim 1 , wherein the metallizing treatment is a process selected from the group consisting of sputtering deposition, vapor deposition, electroplating, chemical deposition, low-temperature plasma jet, and a combination of any two of the previous processes.

9. The method of forming conductive traces on insulated substrate as claimed in claim 1 , wherein the metallizing treatment uses a material selected from the group consisting of pure copper and a copper alloy.

10. The method of forming conductive traces on insulated substrate as claimed in claim 1 , wherein the metallized layer of conductive traces can be one single circuit structure located on the surface of the insulated substrate, or a plurality of circuit structures located at different portions of the surface of the insulated substrate.

Assignees

• Luxshare-Ict Co Ltd
• Luxshare Precision Industry Co Ltd

Inventors

• Wang Devin

Classifications

• H05K3/188 Primary

  by direct electroplating · CPC title

• H05K3/061

  Etching masks · CPC title

• H05K2201/09018

  Rigid curved substrate · CPC title

• B23K26/364

  for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

• B23K26/40

  taking account of the properties of the material involved · CPC title