Circuit module
US-2024237188-A9 · Jul 11, 2024 · US
Adjacent components
Adjacent components · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2201/10522 |
| Official title | Adjacent components |
| Display label | Adjacent components |
| Total patents | 1,196 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 40 |
| 2016 | 48 |
| 2017 | 78 |
| 2018 | 150 |
| 2019 | 190 |
| 2020 | 196 |
| 2021 | 139 |
| 2022 | 75 |
| 2023 | 79 |
| 2024 | 77 |
| 2025 | 95 |
| 2026 | 29 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Data processing device
US-9530457-B2 · Dec 27, 2016 · US
Circuit board configurations facilitating operation of heat sensitive sensor components
US-2016334279-A1 · Nov 17, 2016 · US
Package structures having integrated waveguides for high speed communications between package components
US-2016336282-A1 · Nov 17, 2016 · US
Scalable fabrication techniques and circuit packaging devices
US-2016330837-A1 · Nov 10, 2016 · US
Circuit device and method of manufacturing the same
US-9485850-B2 · Nov 1, 2016 · US
Wiring board with built-in electronic component and method for manufacturing the same
US-2016316566-A1 · Oct 27, 2016 · US
Wiring board and method for manufacturing the same
US-9480157-B2 · Oct 25, 2016 · US
Electronic control unit
US-2016295682-A1 · Oct 6, 2016 · US
Package structures having integrated waveguides for high speed communications between package components
US-2016276727-A1 · Sep 22, 2016 · US
Package structures having integrated waveguides for high speed communications between package components
US-2016276729-A1 · Sep 22, 2016 · US
Wireless communication module, LED lighting device, solar photovoltaic system, self-start system and detection device
US-9380724-B2 · Jun 28, 2016 · US
Chip and circuit structure
US-9345124-B2 · May 17, 2016 · US
High density organic bridge device and method
US-2016133552-A1 · May 12, 2016 · US
Semiconductor device, and image forming apparatus and image reading apparatus using the same
US-9338890-B2 · May 10, 2016 · US
Dual-sided radio-frequency package having ball grid array
US-2016099192-A1 · Apr 7, 2016 · US
Printed wiring board and semiconductor device having the same
US-2016095219-A1 · Mar 31, 2016 · US
Multilayer wiring board with built-in electronic component and method for manufacturing the same
US-9282635-B2 · Mar 8, 2016 · US
Display apparatus
US-2016027398-A1 · Jan 28, 2016 · US
Electronic component embedded substrate
US-9237654-B2 · Jan 12, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2201/10522?
- CPC H05K2201/10522 is the Cooperative Patent Classification code for “Adjacent components.”
- How many patents are filed under CPC H05K2201/10522 (Adjacent components)?
- Our database includes 1,196 publications tagged with this CPC code.
- Is patent activity under CPC H05K2201/10522 growing?
- Publication counts under this code: 77 in 2024 vs 95 in 2025 (latest complete years).