Semiconductor device, and image forming apparatus and image reading apparatus using the same

Patent metadata

Field	Value
Publication number	US-9338890-B2
Application number	US-201514724286-A
Country	US
Kind code	B2
Filing date	May 28, 2015
Priority date	May 29, 2014
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

A semiconductor device includes: a printed wiring board; plural semiconductor array elements mounted on the printed wiring board in a row with an adhesive, each of the semiconductor array elements including plural semiconductor elements arranged in a row, the semiconductor array elements including a first semiconductor array element and a second semiconductor array element adjacent to the first semiconductor array element, the first semiconductor array element having a first facing surface, the second semiconductor array element having a second facing surface facing the first facing surface; a first contact prevention member that is made of organic material and disposed to project from the first facing surface; and a second contact prevention member that is made of organic material and disposed to project from the second facing surface. The first and second contact prevention members are disposed to abut each other or face each other with a gap therebetween.

First claim

What is claimed is:

1. A semiconductor device comprising:
a printed wiring board;
a plurality of semiconductor array elements mounted on the printed wiring board in a row with an adhesive, each of the plurality of semiconductor array elements including a plurality of semiconductor elements arranged in a row, the plurality of semiconductor array elements including a first semiconductor array element and a second semiconductor array element adjacent to the first semiconductor array element, the first semiconductor array element having a first facing surface, the second semiconductor array element having a second facing surface facing the first facing surface;
a first contact prevention member that is made of organic material and disposed to project from the first facing surface; and
a second contact prevention member that is made of organic material and disposed to project from the second facing surface,
wherein the first contact prevention member and the second contact prevention member are disposed to abut each other or face each other with a gap between the first contact prevention member and the second contact prevention member.

2. The semiconductor device of claim 1 , wherein the plurality of semiconductor array elements are arranged in a straight line.

3. The semiconductor device of claim 1 , wherein the plurality of semiconductor array elements are arranged in a staggered manner.

4. The semiconductor device of claim 1 , wherein the first contact prevention member and the second contact prevention member are formed so that the second contact prevention member is fitted in the first contact prevention member,
and wherein the first contact prevention member and the second contact prevention member face each other in a first direction in which the first facing surface and the second facing surface face each other and a second direction different from the first direction.

5. The semiconductor device of claim 4 , wherein at least one of the first contact prevention member and the second contact prevention member has an R-shape.

6. The semiconductor device of claim 4 , wherein at least one of the first contact prevention member and the second contact prevention member has a tapered shape.

7. The semiconductor device of claim 1 , wherein the first contact prevention member and the second contact prevention member cover the first facing surface and the second facing surface on a side opposite the printed wiring board.

8. The semiconductor device of claim 1 , wherein the first contact prevention member and the second contact prevention member are formed of epoxy resin.

9. The semiconductor device of claim 1 , wherein the first contact prevention member and the second contact prevention member are formed of acrylic resin.

10. The semiconductor device of claim 1 , wherein the first contact prevention member and the second contact prevention member are formed of imide resin.

11. The semiconductor device of claim 1 , wherein the first contact prevention member and the second contact prevention member are formed of silicone resin.

12. The semiconductor device of claim 1 , wherein the first contact prevention member and the second contact prevention member are formed of dry film resist.

13. The semiconductor device of claim 1 , wherein the plurality of semiconductor elements are light emitting elements.

14. The semiconductor device of claim 1 , wherein the plurality of semiconductor elements are light receiving elements.

15. An image forming apparatus comprising an optical print head including:
the semiconductor device of claim 13 ;
a rod lens array that focuses light emitted by the light emitting elements; and
a frame that holds the semiconductor device and the rod lens array in a predetermined positional relationship.

16. An image reading apparatus comprising a contact image sensor head including:
the semiconductor device of claim 14 ;
a rod lens array that focuses light on the light receiving elements; and
a frame that holds the semiconductor device and the rod lens array in a predetermined positional relationship.

Assignees

• Oki Data Kk

Inventors

• Suzuki Takahito
• Kuroki Eisuke

Classifications

• H05K2201/2036

  Permanent spacer or stand-off in a printed circuit or printed circuit assembly · CPC title

• H05K2201/10522

  Adjacent components · CPC title

• B41J2/447

  using arrays of radiation sources (B41J2/475 takes precedence) · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title

• H05K2201/09827

  Tapered, e.g. tapered hole, via or groove · CPC title