Circuit device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9485850-B2
Application number	US-201313951603-A
Country	US
Kind code	B2
Filing date	Jul 26, 2013
Priority date	Sep 25, 2012
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

A circuit device includes a heat detection component including lead terminals and a heat detection element, a heat-generating electronic component including lead terminals, and a substrate including a wiring pattern, holes, and lands, the heat detection component and the heat-generating electronic component being electrically connected to the substrate through the lead terminals thereof, wherein the lead terminals of the heat detection component are bent into a U-shaped or substantially U-shaped configuration such that the bent lead terminals are partly contacted with the heat-generating electronic component, and the heat-generating electronic component is sandwiched between portions of the lead terminals and the heat detection element of the heat detection component.

First claim

What is claimed is:

1. A circuit device comprising:
a heat detection component including lead terminals and a heat detection element;
a heat-generating electronic component including lead terminals; and
a substrate including a wiring pattern, holes, and lands; wherein
the heat detection component and the heat-generating electronic component are electrically connected to the substrate through the lead terminals thereof;
the lead terminals of the heat detection component are bent into a U-shaped or substantially U-shaped configuration such that the lead terminals include bent U-shaped portions and are partly contacted with the heat-generating electronic component, and such that the heat detection component detects a temperature of the heat-generating electronic component; and
the heat-generating electronic component is sandwiched between the bent U-shaped portions of the lead terminals of the heat detection component and the heat detection element of the heat detection component.

2. The circuit device according to claim 1 , wherein the lead terminals of the heat detection component are covered with an insulating resin.

3. The circuit device according to claim 1 , wherein the heat detection component is a temperature fuse.

4. The circuit device according to claim 1 , wherein the heat-generating electronic component is one of a varistor, a semiconductor device, and a transformer.

5. The circuit device according to claim 1 , wherein
the heat detection element is fixed at a central position of the heat-generating electronic component.

6. The circuit device according to claim 1 , wherein
the heat detection element is fixed at position that is spaced away from a central position of the heat-generating electronic component.

7. The circuit device according to claim 1 , further comprising a plurality of the heat-generating electronic components arranged such that the heat detection component detects heat emitted by the heat-generating electronic components.

8. The circuit device according to claim 7 , wherein the heat detection component is surrounded by the heat-generating electronic components.

9. The circuit device according to claim 1 , wherein
the lead terminals of the heat detection component are vertically inserted to the holes in the substrate.

10. The circuit device according to claim 1 , wherein
the lead terminals of the heat detection component are obliquely inserted to the holes in the substrate.

Assignees

• Murata Manufacturing Co

Inventors

• Fukumoto Mitsuteru

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H05K2201/10757

  Bent leads · CPC title

• H01L2924/0002

  Electricity · mapped topic

• H05K2201/10522

  Adjacent components · CPC title