Printed circuit board and printing apparatus
US-11758643-B2 · Sep 12, 2023 · US
Electric details
Electric details · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2201/07 |
| Official title | Electric details |
| Display label | Electric details |
| Total patents | 74 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 7 |
| 2017 | 17 |
| 2018 | 16 |
| 2019 | 4 |
| 2020 | 5 |
| 2021 | 2 |
| 2022 | 5 |
| 2023 | 4 |
| 2024 | 6 |
| 2025 | 3 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Circuit board structure and method of manufacturing the same
US-2022369474-A1 · Nov 17, 2022 · US
Printed circuit board and printing apparatus
US-2022256689-A1 · Aug 11, 2022 · US
Printed circuit board and printing apparatus
US-11343903-B2 · May 24, 2022 · US
Electronic device
US-2022039251-A1 · Feb 3, 2022 · US
Three dimensional integrated circuit electrostatic discharge protection and prevention test interface
US-11229109-B2 · Jan 18, 2022 · US
Mating backplane for high speed, high density electrical connector
US-2021076486-A1 · Mar 11, 2021 · US
Printed circuit board and printing apparatus
US-2021045232-A1 · Feb 11, 2021 · US
Mating backplane for high speed, high density electrical connector
US-10849218-B2 · Nov 24, 2020 · US
Three dimensional integrated circuit electrostatic discharge protection and prevention test interface
US-2020245439-A1 · Jul 30, 2020 · US
Three dimensional integrated circuit electrostatic discharge protection and prevention test interface
US-10652987-B2 · May 12, 2020 · US
Multilayer printed wiring board, and connection structure of multilayer printed wiring board and connector
US-10548220-B2 · Jan 28, 2020 · US
Mating backplane for high speed, high density electrical connector
US-2020022252-A1 · Jan 16, 2020 · US
Mating backplane for high speed, high density electrical connector
US-10455689-B2 · Oct 22, 2019 · US
Dust guard structure
US-10398044-B2 · Aug 27, 2019 · US
Compensating for intra-pair skew in differential signaling
US-10349514-B2 · Jul 9, 2019 · US
Dust guard structure
US-2019037718-A1 · Jan 31, 2019 · US
High-frequency signal line and manufacturing method thereof
US-10158157-B2 · Dec 18, 2018 · US
Dust guard structure
US-10136532-B2 · Nov 20, 2018 · US
Electrical connectors and printed circuits having broadside-coupling regions
US-10135194-B2 · Nov 20, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2201/07?
- CPC H05K2201/07 is the Cooperative Patent Classification code for “Electric details.”
- How many patents are filed under CPC H05K2201/07 (Electric details)?
- Our database includes 74 publications tagged with this CPC code.
- Is patent activity under CPC H05K2201/07 growing?
- Publication counts under this code: 6 in 2024 vs 3 in 2025 (latest complete years).