Printed circuit board and printing apparatus

Patent metadata

Field	Value
Publication number	US-11758643-B2
Application number	US-202217729933-A
Country	US
Kind code	B2
Filing date	Apr 26, 2022
Priority date	Aug 9, 2019
Publication date	Sep 12, 2023
Grant date	Sep 12, 2023

Abstract

A printed circuit board includes a front layer including frame ground regions on which connectors to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region which is separated from the frame ground regions at the front layer, on which electronic devices configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region separated from the frame ground regions and the signal ground region at the front layer, situated outside the frame ground regions, and connected with a ground.

First claim

What is claimed is:

1. A printed circuit board comprising a conductor layer designed on one side of one substrate layer including:
a first ground region on which a connector to be connected with an external apparatus or communication cable is mounted and which is connected with a ground; and
a second ground region separated from the first ground region at the conductor layer, the second ground region being at a position that is outside the first ground region at least in a region corresponding to an opening of the connector on the conductor layer, and connected with a ground,
wherein the opening is an insertion opening of the connector into which the external apparatus or the communication cable are to be inserted.

2. The printed circuit board according to claim 1 , wherein the second ground region is situated to surround the first ground region.

3. The printed circuit board according to claim 2 , wherein the second ground region is situated to surround the first ground region without a discontinuity.

4. The printed circuit board according to claim 1 , wherein the second ground region is situated to surround an electronic component.

5. The printed circuit board according to claim 4 , wherein the second ground region is situated to surround the electronic component without a discontinuity.

6. The printed circuit board according to claim 4 , wherein the electronic component is connected with the connector via a signal line.

7. The printed circuit board according to claim 1 , wherein the electronic component is an IC chip.

8. The printed circuit board according to claim 1 , wherein the conductor layer further includes a third ground region which is separated from the first ground region, and the second ground region at the conductor layer, on which another connector to be connected with another external apparatus or communication cable is mounted, and which is connected with a ground.

9. The printed circuit board according to claim 1 , wherein the printed circuit board is a multi-layer printed circuit board including at least a signal layer, a power layer, and a ground layer.

10. The printed circuit board according to claim 9 , wherein the first ground region and the second ground region are connected at the ground layer.

11. The printed circuit board according to claim 1 , wherein the first ground region is connected with a metallic housing of the connector.

12. The printed circuit board according to claim 1 , wherein the second ground region includes a hole or notch through which a fixing member configured to fix the printed circuit board to a housing is passed.

13. The printed circuit board according to claim 12 , wherein the fixing member is a metallic fixing member and the housing is a metallic housing.

14. The printed circuit board according to claim 1 , wherein the printed circuit board is a printed circuit board of a printing apparatus.

15. A printing apparatus comprising:
a printed circuit board according to claim 1 ; and
a printing unit configured to print an image on a sheet.

Assignees

• Canon Kk

Inventors

• Kobayashi Yo
• Hirai Koji

Classifications

• H05K1/0215 Primary

  Grounding of printed circuits by connection to external grounding means · CPC title

• H05K1/0259 Primary

  Electrostatic discharge [ESD] protection · CPC title

• H05K1/0219 Primary

  Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors · CPC title

• B41J3/445

  Printers integrated in other types of apparatus, e.g. printers integrated in cameras · CPC title

• H05K1/0254

  High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection (electrostatic discharge protection for electric apparatus in general H05K9/0067, H05K9/0079); Arrangements for regulating voltages or for using plural voltages · CPC title