High-frequency signal line and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10158157-B2
Application number	US-201615364899-A
Country	US
Kind code	B2
Filing date	Nov 30, 2016
Priority date	Oct 31, 2012
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.

First claim

What is claimed is:

1. A high-frequency signal line comprising:
a first dielectric element assembly including a linear shape, a first end and a second end, and a plate-shaped configuration with a first principal surface and a second principal surface;
a linear first signal line provided in or on the first dielectric element assembly and extending along the first dielectric element assembly;
a first ground conductor provided in or on the first dielectric element assembly and extending along the first signal line;
a second dielectric element assembly including a linear shape, a third end and a fourth end, and a plate-shaped configuration with a third principal surface and a fourth principal surface;
a linear second signal line provided in or on the second dielectric element assembly and extending along the second dielectric element assembly; and
a second ground conductor provided in or on the second dielectric element assembly and extending along the second signal line; wherein
a portion of the second principal surface at the first end of the first dielectric element assembly and a portion of the third principal surface at the third end of the second dielectric element assembly are joined together such that a joint portion of the first dielectric element assembly and the second dielectric element assembly includes a corner;
the corner is a bent portion that is bent in a planar direction of the high-frequency signal line;
the first signal line and the second signal line are electrically coupled together;
the first ground conductor and the second ground conductor are electrically coupled together;
the first signal line is provided in the first dielectric element assembly;
the second signal line is provided in the second dielectric element assembly;
the high-frequency signal line includes:
a first connecting conductor provided on a portion of the second principal surface at the first end of the first dielectric element assembly and electrically coupled to the first signal line; and
a second connecting conductor provided on a portion of the third principal surface at the third end of the second dielectric element assembly and electrically coupled to the second signal line;

the first connecting conductor and the second connecting conductor are soldered together;
a portion of the first signal line at the first end of the first dielectric element assembly is located on one side of the first dielectric element assembly with respect to a width direction of the first dielectric element assembly; and
a portion of the first ground conductor at the first end of the first dielectric element assembly is located on the other side of the first dielectric element with respect to the first signal line in the width direction of the first dielectric element assembly and is not located on the one side of the first dielectric element assembly with respect to the first signal line in the width direction of the first dielectric element assembly.

2. The high-frequency signal line according to claim 1 , further comprising:
a first dummy conductor provided on a portion of the second principal surface at the first end of the first dielectric element assembly; and
a second dummy conductor provided on a portion of the third principal surface at the third end of the second dielectric element assembly; wherein
the first dummy conductor and the second dummy conductor are soldered together.

3. The high-frequency signal line according to claim 2 , further comprising:
a third dummy conductor provided in the first dielectric element assembly; and
a fifth via-hole conductor connecting the first dummy conductor to the third dummy conductor.

4. The high-frequency signal line according to claim 2 , further comprising:
a fourth dummy conductor provided in the second dielectric element assembly; and
a sixth via-hole conductor connecting the second dummy conductor to the fourth dummy conductor.

5. The high-frequency signal line according to claim 1 , wherein the first ground conductor is provided on a first principal surface side relative to the first signal line;
the second ground conductor is provided on a third principal surface side relative to the second signal line;
the high-frequency signal line includes:
a third ground conductor provided on the second principal surface side relative to the first signal line in the first dielectric element assembly and extending along the first signal line; and
a fourth ground conductor provided on the fourth principal surface side relative to the second signal line in the second dielectric element assembly and extending along the second signal line; and

the first through fourth ground conductors are electrically coupled together.

6. The high-frequency signal line according to claim 1 , wherein the first dielectric element assembly and/or the second dielectric element assembly has a linear shape.

7. The high-frequency signal line according to claim 1 , wherein the first dielectric element assembly and the second dielectric element assembly have flexibility.

8. A method for manufacturing a high-frequency signal line, the method comprising the steps of:
forming a first signal line portion including a first dielectric element assembly including a linear shape, a first end and a second end, and a plate-shaped configuration with a first principal surface and a second principal surface, a linear first signal line provided in or on the first dielectric element assembly and extending along the first dielectric element assembly, and a first ground conductor provided in or on the first dielectric element assembly and extending along the first signal line;
forming a second signal line portion including a second dielectric element assembly including a linear shape, a third end and a fourth end, and having a plate-shaped configuration with a third principal surface and a fourth principal surface, a linear second signal line provided in or on the second dielectric element assembly and extending along the second dielectric element assembly, and a second ground conductor provided in or on the second dielectric element assembly and extending along the second signal line; and
joining together a portion of the second principal surface at the first end of the first dielectric element assembly and a portion of the third principal surface at the third end of the second dielectric element assembly such that the first signal line and the second signal line are electrically coupled together and the first ground conductor and the second ground conductor are electrically coupled together and such that a joint portion of the first signal line portion and the second signal line portion includes a corner; wherein
the corner is a bent portion that is bent in a planar direction of the high-frequency signal line;
a portion of the first signal line at the first end of the first dielectric element assembly is located on one side of the first dielectric element assembly with respect to a width direction of the first dielectric element assembly; and
a portion of the first ground conductor at the first end of the first dielectric element assembly is located on the other side of the first dielectric element with respect to the first signal line in the width direction of the first dielectric element assembly and is not located on the one side of the first dielectric element assembly with respect to the first signal line in the width direction of the first dielectric element assembly.

9. The method according to claim 8 , wherein the step of forming the first signal line portion includes:
forming the first signal line on a third dielectric layer:
forming the first ground conductor on a fourth dielectric layer; and
laminating a plurali

Assignees

• Murata Manufacturing Co

Inventors

• Ikemoto Nobuo
• Wakabayashi Yuki
• Tago Shigeru

Classifications

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H01R2103/00

  Two poles · CPC title

• Y10T29/49016

  Antenna or wave energy "plumbing" making · CPC title

• H01P3/082 Primary

  Multilayer dielectric · CPC title

• H05K2201/09527

  Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms · CPC title