Optical semiconductor device
US-9508662-B2 · Nov 29, 2016 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L31/02002 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 338 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 35 |
| 2016 | 43 |
| 2017 | 44 |
| 2018 | 34 |
| 2019 | 28 |
| 2020 | 33 |
| 2021 | 32 |
| 2022 | 38 |
| 2023 | 24 |
| 2024 | 25 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus
US-9508772-B2 · Nov 29, 2016 · US
Wafer-level flip chip device packages and related methods
US-9496472-B2 · Nov 15, 2016 · US
Electronic device comprising an optical sensor chip
US-9478677-B2 · Oct 25, 2016 · US
Optoelectronic Semiconductor Apparatus and Carrier Assembly
US-2016293587-A1 · Oct 6, 2016 · US
Semiconductor device, semiconductor device array, and image formation apparatus
US-2016293816-A1 · Oct 6, 2016 · US
Solid image-pickup device with through hole passing through substrate
US-9455286-B2 · Sep 27, 2016 · US
Methods for performing embedded wafer-level packaging (eWLP) and eWLP devices, packages and assemblies made by the methods
US-9443835-B2 · Sep 13, 2016 · US
Optoelectronic semiconductor chip and method for production thereof
US-9425358-B2 · Aug 23, 2016 · US
Methods for performing extended wafer-level packaging (eWLP) and eWLP devices made by the methods
US-9425175-B2 · Aug 23, 2016 · US
Interconnect structure for CIS flip-chip bonding and methods for forming the same
US-9397137-B2 · Jul 19, 2016 · US
Optoelectronic semiconductor apparatus and carrier assembly
US-9397076-B2 · Jul 19, 2016 · US
Dual compressive connector
US-9391385-B2 · Jul 12, 2016 · US
METHODS FOR PERFORMING EXTENDED WAFER-LEVEL PACKAGING (eWLP) AND eWLP DEVICES MADE BY THE METHODS
US-2016141279-A1 · May 19, 2016 · US
Heat removal from photonic devices
US-2016141831-A1 · May 19, 2016 · US
CIS chips and methods for forming the same
US-9324756-B2 · Apr 26, 2016 · US
Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin composition
US-2016111611-A1 · Apr 21, 2016 · US
Packaged semiconductor devices and related methods
US-2016111581-A1 · Apr 21, 2016 · US
Optical semiconductor device including blackened tarnishable bond wires and related methods
US-2016104805-A1 · Apr 14, 2016 · US
Solid-state imaging device and method for manufacturing solid-state imaging device
US-9312296-B2 · Apr 12, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L31/02002?
- CPC H01L31/02002 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L31/02002 (Electricity)?
- Our database includes 338 publications tagged with this CPC code.
- Is patent activity under CPC H01L31/02002 growing?
- Publication counts under this code: 25 in 2024 vs 2 in 2025 (latest complete years).