Optoelectronic semiconductor apparatus and carrier assembly

Patent metadata

Field	Value
Publication number	US-9397076-B2
Application number	US-201314428326-A
Country	US
Kind code	B2
Filing date	Sep 10, 2013
Priority date	Sep 14, 2012
Publication date	Jul 19, 2016
Grant date	Jul 19, 2016

Abstract

A semiconductor apparatus with an optoelectronic device and a further device is disclosed. Embodiments of the invention provide a semiconductor apparatus with an optoelectronic device and a further device, wherein the optoelectronic device and the further device are interconnected to one another in parallel when the semiconductor apparatus is in operation, wherein the optoelectronic device is connected to a first contact and a second contact, the first contact and the second contact being configured to externally contact the semiconductor apparatus, and wherein the further device is connected with at least one further contact of the semiconductor apparatus.

First claim

The invention claimed is:

1. A semiconductor apparatus comprising:
an optoelectronic device;
a further device; and
a carrier with a major face facing the optoelectronic device and a back remote from the optoelectronic device,
wherein the optoelectronic device and the further device are interconnected to one another in parallel when the semiconductor apparatus is in operation,
wherein the optoelectronic device is connected with a first contact and a second contact, the first contact and the second contact being externally connectable
wherein the first contact comprises a first back contact surface,
wherein the second contact comprises a second back contact surface,
wherein the further device is connected with a further contact of the semiconductor apparatus,
wherein the further contact comprises a further back contact surface, and
wherein the first back contact surface, the second back contact surface and the further back contact surface are arranged on the back of the carrier.

2. The semiconductor apparatus according to claim 1 , further comprising a connection carrier, the first contact and the further contact are fastened to a common electrical connection carrier land of the connection carrier.

3. The semiconductor apparatus according to claim 1 , wherein the optoelectronic device, prior to mounting on a connection carrier, is independently operable of the further device via the first contact and the second contact.

4. The semiconductor apparatus according to claim 1 , wherein the further device is electrically conductively connected with the second contact.

5. The semiconductor apparatus according to claim 1 , wherein the carrier comprises a first land on the major face, the first land being electrically conductively connected with the optoelectronic device and being electrically conductively connected by a through via through the carrier with the back remote from the optoelectronic device with the first back contact surface of the first contact.

6. The semiconductor apparatus according to claim 5 , wherein the carrier further comprises a first front contact surface on the major face, and wherein the first front contact surface is spaced from the first land and is connected by a further through via with the first back contact surface.

7. The semiconductor apparatus according to claim 6 , wherein the semiconductor apparatus is free of a direct front current path between the first land and the first front contact surface and a current path between the first land and the first front contact surface passes twice through the carrier in a vertical direction extending perpendicularly to the major face.

8. The semiconductor apparatus according to claim 1 ,
wherein the carrier comprises a first land on the major face, which land is electrically conductively connected with the optoelectronic device,
wherein the carrier comprises a second land on the major face, which land is electrically conductively connected with the optoelectronic device,
wherein the carrier comprises a further front contact surface on the major face, which further front contact surface is electrically conductively connected by a through via through the carrier with the further back contact surface of the further contact arranged on the back remote from the optoelectronic device, and
wherein a current path extending through the carrier between the further front contact surface and the second land forms an ESD protective diode.

9. The semiconductor apparatus according to claim 1 , wherein the further device is integrated into the carrier.

10. The semiconductor apparatus according to claim 1 , wherein the carrier contains a semiconductor material.

11. The semiconductor apparatus according to claim 1 , wherein the further device is an ESD protective diode.

12. The semiconductor apparatus according to claim 1 , wherein the further device is a further optoelectronic device.

13. The semiconductor apparatus according to claim 1 , wherein a distance between the first contact and the further contact is smaller than a distance between the first contact and the second contact.

14. A semiconductor apparatus with an optoelectronic device and a further device,
wherein the optoelectronic device and the further device are interconnected to one another in parallel when the semiconductor apparatus is in operation,
wherein the optoelectronic device is connected to a first contact and a second contact, the first contact and the second contact being externally connectable
wherein the further device is connected with a further contact of the semiconductor apparatus, the further device being externally electrically connectable via the further contact,
wherein the further device is electrically insulated from at least one of the first contact and the second contact,
wherein the semiconductor apparatus comprises a carrier with a major face facing the optoelectronic device and with a back arranged remote from the optoelectronic device,
wherein the optoelectronic device is arranged on the major face, and
wherein the first contact, the second contact and the further contact are accessible from the back.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Herrmann Siegfried

Classifications

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title