Solid image-pickup device with through hole passing through substrate

Patent metadata

Field	Value
Publication number	US-9455286-B2
Application number	US-201514727311-A
Country	US
Kind code	B2
Filing date	Jun 1, 2015
Priority date	Oct 4, 2001
Publication date	Sep 27, 2016
Grant date	Sep 27, 2016

Abstract

A solid image-pickup device has a semiconductor substrate, which includes an image-pickup area having a plurality of light sensors arranged thereon. A transparent plate having the same shape and the same size as those of the semiconductor substrate when viewed as a plan view is bonded to the surface of the semiconductor substrate. Also, a through hole extends from the second side of the semiconductor device towards the first side. An electrically conductive material is located in the through hole. Additionally, the electrically conductive material is physically connected to at least a portion of a lower surface of a laminar layer portion comprising at least one conductive layer located at the first side of the semiconductor substrate and is electrically connected to the laminar layer portion.

First claim

What is claimed is:

1. An imaging device comprising:
a semiconductor substrate having a first side as a light incident side and a second side opposite the first side;
an image pick-up area disposed in the semiconductor substrate and having at least one light sensor;
a through hole extending from the second side of the semiconductor substrate towards the first side;
a transparent plate disposed along the first side;
a cavity disposed between the transparent plate and the image pick-up area and disposed over the semiconductor substrate in an area of the semiconductor substrate without the through hole;
an insulating film covering inner side surfaces of the through hole; and
an electrically conductive material disposed in the through hole, wherein the electrically conductive material is physically connected to at least a portion of a lower surface of a laminar layer portion comprising at least one conductive layer located at the first side of the semiconductor substrate and is electrically connected to the laminar layer portion,
wherein a light-receiving surface of the image pick-up area and the first side of the semiconductor substrate are coplanar.

2. The imaging device according to claim 1 , wherein the transparent plate has substantially the same shape and substantially the same size as said semiconductor substrate from a plan view perspective.

3. The imaging device according to claim 1 , wherein the transparent plate is fixed over a surface of said semiconductor substrate with a sealing agent disposed between the transparent plate and said semiconductor substrate, said sealing agent is disposed exclusively along edge portions of the surface of said semiconductor substrate, with the cavity surrounded by said sealing agent being sealed airtight.

4. The imaging device according to claim 3 , wherein the area of the semiconductor substrate without the through hole is located interior to the edge portions of the surface of said semiconductor substrate.

5. The imaging device according to claim 1 , wherein the electrically conductive material is provided inside the through hole adjacent the insulating film.

6. The imaging device according to claim 1 , wherein the transparent plate is made of a glass.

7. The imaging device according to claim 1 , wherein the through hole has a depth of 100 μm or less.

8. A package including an imaging device comprising;
a semiconductor substrate having a first side as a light incident side and a second side opposite the first side;
an image pick-up area disposed in the semiconductor substrate and having at least one light sensor;
through holes extending from the second side of the semiconductor substrate towards the first side;
a transparent plate disposed along the first side;
a cavity disposed between the transparent plate and the image pick-up area and disposed over the semiconductor substrate in an area of the semiconductor substrate without the through holes; and
an electrically conductive material disposed in the through holes and being physically connected to at least a portion of a lower surface of a laminar layer portion comprising at least one conductive layer located at the first side of the semiconductor substrate and being electrically connected to the laminar layer portion,
wherein a light-receiving surface of the image pick-up area and the first side of the semiconductor substrate are coplanar.

9. The package according to claim 8 , wherein the transparent plate is fixed over a surface of the semiconductor substrate above an imaging area and when viewed as a plan view has substantially the same shape and substantially the same size as the semiconductor substrate from a plan view perspective.

10. The package according to claim 8 , wherein the transparent plate is fixed over a surface of the semiconductor substrate with a sealing agent disposed between the transparent plate and the semiconductor substrate, the sealing agent is disposed exclusively along edge portions of the surface of the semiconductor substrate and over the laminar layer portion, with the cavity surrounded by the sealing agent being sealed airtight.

11. The package according to claim 10 , wherein the area of the semiconductor substrate without the through holes is located interior to the edge portions of the surface of said semiconductor substrate.

12. The package according to claim 8 , wherein the electrically conductive material is provided inside the through holes extending from the laminar layer portion to provide electrical communication with the second side of the semiconductor substrate.

13. The package according to claim 8 , wherein the transparent plate is made of a glass.

14. The package according to claim 8 , wherein the through holes have a respective depth of 100 μm or less.

Assignees

• Sony Corp

Inventors

• Wataya Yukinobu

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5525

  comprising copper [Cu] · CPC title

• H10F39/809

  of hybrid image sensors · CPC title

• H04N23/00

  Cameras or camera modules comprising electronic image sensors; Control thereof · CPC title

• H10F39/018

  of hybrid image sensors · CPC title